Import Database of Vietnam Copper Imports from Tien-s-inland-port-authorityheyn Under HS Code 38

Live copper import data of Vietnam imports Data under HS code 38 from Tien-s-inland-port-authorityheyn, our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam copper importers data. This detailed trade intelligence helps businesses analyze import trends, monitor competitor activities, & identify potential opportunities in Vietnam-Tien-s-inland-port-authorityheyn copper trade under HS Code 38.

Verified Data of Vietnam Copper Imports from Tien-s-inland-port-authorityheyn by HS Code 38

Date

HS Code

Product Description

Origin Country

Custom Name

QTY.

Unit

Value($)

Importer Name

2024-04-17 00:00:00
38249999
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new Korea (Republic) Tien S Inland Port AuthorityHeyn 200 LTR 3172 Importer Name
2024-04-22 00:00:00
38101000
Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 30 KGM 2430 Importer Name
2024-04-22 00:00:00
38101000
Soldering paste S3X58-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 10 KGM 752 Importer Name
2024-04-25 00:00:00
38101000
EX-03-00025-V01#&Chemical used in electroplating step, copper plating electronic circuit board macspec vf-th 200 wetter,Sulfuric acid 0.1-1%+Copper sulfate 0.1-1%+Organic polym1-10% + ...(EX-03-00025) Taiwan Tien S Inland Port AuthorityHeyn 100 LTR 5656.831 Importer Name
2024-04-25 00:00:00
38101000
EX-03-00023-V01#&Chemical used in electroplating, copper plating of electronic circuit boards MACUSPEC PPR 150-K BRIGHTENER, 10% ethanol + 1% sulfuric acid + 89% water (EX-03-00024 ) Taiwan Tien S Inland Port AuthorityHeyn 500 LTR 2960.965 Importer Name
2024-04-26 00:00:00
38101000
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B Korea (Republic) Tien S Inland Port AuthorityHeyn 80000 GRM 6312 Importer Name
2024-04-01 00:00:00
38101000
Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 35 KGM 2597 Importer Name
2024-04-10 00:00:00
38249999
EX-03-00135#&Hh preparation used in plating industry PRINTOGANTH MV COPPER;TP mixed sulphate salt of copper, nickel, additive in acid, liquid medium; Cas:7758-98-7, 87-69-4,7664-93-9,7786-81-4,(EX-03-00135-03) China Tien S Inland Port AuthorityHeyn 600000 GRM 1584 Importer Name
2024-04-01 00:00:00
38101000
EX-03-00025-V01#&Chemical used in electroplating step, copper plating electronic circuit board MACUSPEC VF-TH 200 BR. REPL.sulphuric acid 0.1-1%+copper sulphate 0.1-1%+water 89.9-98%(EX-03-00026) Taiwan Tien S Inland Port AuthorityHeyn 60 LTR 3384.6432 Importer Name
2024-04-01 00:00:00
38101000
Soldering paste S3X58-A340, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 90 KGM 6678 Importer Name

Shipment No. 1

Date

2024-04-17 00:00:00

HS CODE

Product Description

OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new

Origin Country

Unloading Port

QTY

200

Unit

LTR

Value($)

3172

Importer Name

Shipment No. 2

Date

2024-04-22 00:00:00

HS CODE

Product Description

Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

30

Unit

KGM

Value($)

2430

Importer Name

Shipment No. 3

Date

2024-04-22 00:00:00

HS CODE

Product Description

Soldering paste S3X58-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

10

Unit

KGM

Value($)

752

Importer Name

Shipment No. 4

Date

2024-04-25 00:00:00

HS CODE

Product Description

EX-03-00025-V01#&Chemical used in electroplating step, copper plating electronic circuit board macspec vf-th 200 wetter,Sulfuric acid 0.1-1%+Copper sulfate 0.1-1%+Organic polym1-10% + ...(EX-03-00025)

Origin Country

Unloading Port

QTY

100

Unit

LTR

Value($)

5656.831

Importer Name

Shipment No. 5

Date

2024-04-25 00:00:00

HS CODE

Product Description

EX-03-00023-V01#&Chemical used in electroplating, copper plating of electronic circuit boards MACUSPEC PPR 150-K BRIGHTENER, 10% ethanol + 1% sulfuric acid + 89% water (EX-03-00024 )

Origin Country

Unloading Port

QTY

500

Unit

LTR

Value($)

2960.965

Importer Name

Shipment No. 6

Date

2024-04-26 00:00:00

HS CODE

Product Description

NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B

Origin Country

Unloading Port

QTY

80000

Unit

GRM

Value($)

6312

Importer Name

Shipment No. 7

Date

2024-04-01 00:00:00

HS CODE

Product Description

Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

35

Unit

KGM

Value($)

2597

Importer Name

Shipment No. 8

Date

2024-04-10 00:00:00

HS CODE

Product Description

EX-03-00135#&Hh preparation used in plating industry PRINTOGANTH MV COPPER;TP mixed sulphate salt of copper, nickel, additive in acid, liquid medium; Cas:7758-98-7, 87-69-4,7664-93-9,7786-81-4,(EX-03-00135-03)

Origin Country

Unloading Port

QTY

600000

Unit

GRM

Value($)

1584

Importer Name

Shipment No. 9

Date

2024-04-01 00:00:00

HS CODE

Product Description

EX-03-00025-V01#&Chemical used in electroplating step, copper plating electronic circuit board MACUSPEC VF-TH 200 BR. REPL.sulphuric acid 0.1-1%+copper sulphate 0.1-1%+water 89.9-98%(EX-03-00026)

Origin Country

Unloading Port

QTY

60

Unit

LTR

Value($)

3384.6432

Importer Name

Shipment No. 10

Date

2024-04-01 00:00:00

HS CODE

Product Description

Soldering paste S3X58-A340, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

90

Unit

KGM

Value($)

6678

Importer Name

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