Import Database of Vietnam Copper Imports from Tien-s-inland-port-authorityheyn Under HS Code 382499

Live copper import data of Vietnam imports Data under HS code 382499 from Tien-s-inland-port-authorityheyn, our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam copper importers data. This detailed trade intelligence helps businesses analyze import trends, monitor competitor activities, & identify potential opportunities in Vietnam-Tien-s-inland-port-authorityheyn copper trade under HS Code 382499.

Verified Data of Vietnam Copper Imports from Tien-s-inland-port-authorityheyn by HS Code 382499

Date

HS Code

Product Description

Origin Country

Custom Name

QTY.

Unit

Value($)

Importer Name

2024-04-17 00:00:00
38249999
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new Korea (Republic) Tien S Inland Port AuthorityHeyn 200 LTR 3172 Importer Name
2024-04-10 00:00:00
38249999
EX-03-00135#&Hh preparation used in plating industry PRINTOGANTH MV COPPER;TP mixed sulphate salt of copper, nickel, additive in acid, liquid medium; Cas:7758-98-7, 87-69-4,7664-93-9,7786-81-4,(EX-03-00135-03) China Tien S Inland Port AuthorityHeyn 600000 GRM 1584 Importer Name
2024-04-10 00:00:00
38249999
EX-03-00139#&Additive KH-71 used to stabilize chemical solutions in copper plating industry, TP:Polyethyleneglycol 1.5%;3-Methoxy-3-Methyl-1-Butanol:1%;4-Hydroxybenzoic acid :0.25%;water:97.25%.(EX-03-00139-01) VIETNAM Tien S Inland Port AuthorityHeyn 300 LTR 3555 Importer Name
2024-04-15 00:00:00
38249999
EX-03-00135#&Hh preparation used in plating industry PRINTOGANTH MV COPPER;TP mixed sulphate salt of copper, nickel, additive in acid, liquid medium; Cas:7758-98-7, 87-69-4,7664-93-9,7786-81-4.(EX-03-00135-03) China Tien S Inland Port AuthorityHeyn 400000 GRM 1056 Importer Name
2024-04-17 00:00:00
38249999
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new Korea (Republic) Tien S Inland Port AuthorityHeyn 200 LTR 3172 Importer Name
2024-04-08 00:00:00
38249999
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new Korea (Republic) Tien S Inland Port AuthorityHeyn 200 LTR 3154 Importer Name
2024-04-17 00:00:00
38249999
OCHW00012#&BMS-903A solution is used to remove the copper layer on the wafer surface after UV irradiation. TP:Sulfinylbismethane 85~90%,1,2-Ethanediol 5~10%,Water 1~5%,Tetramethylammonium hydroxide 0.6 ~1%, 100% new Korea (Republic) Tien S Inland Port AuthorityHeyn 480 LTR 7358.4 Importer Name

Shipment No. 1

Date

2024-04-17 00:00:00

HS CODE

Product Description

OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new

Origin Country

Unloading Port

QTY

200

Unit

LTR

Value($)

3172

Importer Name

Shipment No. 2

Date

2024-04-10 00:00:00

HS CODE

Product Description

EX-03-00135#&Hh preparation used in plating industry PRINTOGANTH MV COPPER;TP mixed sulphate salt of copper, nickel, additive in acid, liquid medium; Cas:7758-98-7, 87-69-4,7664-93-9,7786-81-4,(EX-03-00135-03)

Origin Country

Unloading Port

QTY

600000

Unit

GRM

Value($)

1584

Importer Name

Shipment No. 3

Date

2024-04-10 00:00:00

HS CODE

Product Description

EX-03-00139#&Additive KH-71 used to stabilize chemical solutions in copper plating industry, TP:Polyethyleneglycol 1.5%;3-Methoxy-3-Methyl-1-Butanol:1%;4-Hydroxybenzoic acid :0.25%;water:97.25%.(EX-03-00139-01)

Origin Country

Unloading Port

QTY

300

Unit

LTR

Value($)

3555

Importer Name

Shipment No. 4

Date

2024-04-15 00:00:00

HS CODE

Product Description

EX-03-00135#&Hh preparation used in plating industry PRINTOGANTH MV COPPER;TP mixed sulphate salt of copper, nickel, additive in acid, liquid medium; Cas:7758-98-7, 87-69-4,7664-93-9,7786-81-4.(EX-03-00135-03)

Origin Country

Unloading Port

QTY

400000

Unit

GRM

Value($)

1056

Importer Name

Shipment No. 5

Date

2024-04-17 00:00:00

HS CODE

Product Description

OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new

Origin Country

Unloading Port

QTY

200

Unit

LTR

Value($)

3172

Importer Name

Shipment No. 6

Date

2024-04-08 00:00:00

HS CODE

Product Description

OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new

Origin Country

Unloading Port

QTY

200

Unit

LTR

Value($)

3154

Importer Name

Shipment No. 7

Date

2024-04-17 00:00:00

HS CODE

Product Description

OCHW00012#&BMS-903A solution is used to remove the copper layer on the wafer surface after UV irradiation. TP:Sulfinylbismethane 85~90%,1,2-Ethanediol 5~10%,Water 1~5%,Tetramethylammonium hydroxide 0.6 ~1%, 100% new

Origin Country

Unloading Port

QTY

480

Unit

LTR

Value($)

7358.4

Importer Name

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