Live Copper Import data of Vietnam imports from japan under HS Code 38 via Port Tien-s-inland-port-authorityheyn , our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam copper importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-22 00:00:00 |
38101000
|
Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 30 | KGM | 2430 | Importer Name |
| 2024-04-22 00:00:00 |
38101000
|
Soldering paste S3X58-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 10 | KGM | 752 | Importer Name |
| 2024-04-01 00:00:00 |
38101000
|
Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 35 | KGM | 2597 | Importer Name |
| 2024-04-01 00:00:00 |
38101000
|
Soldering paste S3X58-A340, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 90 | KGM | 6678 | Importer Name |
| 2024-04-01 00:00:00 |
38101000
|
Soldering paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 140 | KGM | 10920 | Importer Name |
| 2024-04-15 00:00:00 |
38101000
|
Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 10 | KGM | 810 | Importer Name |
| 2024-04-16 00:00:00 |
38109000
|
HYF048#&Tin cream/S01XBIG58-M500-4,Tin coated: 82-88%,Copper 0.1-1%,Bi 1-2%,Diluted acid iron reduction 3-5%, 2-(2-Hexyloxyethoxy) ethanol 3 -5%,Dimer acid 1-3%; 100% new product,591,00068,005 | Japan | Tien S Inland Port AuthorityHeyn | 400 | KGM | 23836 | Importer Name |
| 2024-04-22 00:00:00 |
38101000
|
Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 100 | KGM | 7420 | Importer Name |
| 2024-04-22 00:00:00 |
38101000
|
Soldering paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 470 | KGM | 36660 | Importer Name |
2024-04-22 00:00:00
Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%
30
KGM
2430
2024-04-22 00:00:00
Soldering paste S3X58-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%
10
KGM
752
2024-04-01 00:00:00
Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%
35
KGM
2597
2024-04-01 00:00:00
Soldering paste S3X58-A340, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%
90
KGM
6678
2024-04-01 00:00:00
Soldering paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%
140
KGM
10920
2024-04-15 00:00:00
Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%
10
KGM
810
2024-04-16 00:00:00
HYF048#&Tin cream/S01XBIG58-M500-4,Tin coated: 82-88%,Copper 0.1-1%,Bi 1-2%,Diluted acid iron reduction 3-5%, 2-(2-Hexyloxyethoxy) ethanol 3 -5%,Dimer acid 1-3%; 100% new product,591,00068,005
400
KGM
23836
2024-04-22 00:00:00
Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%
100
KGM
7420
2024-04-22 00:00:00
Soldering paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%
470
KGM
36660
The database includes shipment-level information such as shipment date, HS code, product description, quantity, value, port details, country of origin & destination, & importer-exporter information for accurate trade analysis of products under HS code 38 for Vietnam copper imports from Thailand via Port Tien-s-inland-port-authorityheyn.
Port Tien-s-inland-port-authorityheyn typically refers to a port that is used for handling and forwarding shipments into Vietnam, making it important for tracking inland and cross-border trade flows.
It helps businesses understand sourcing patterns, evaluate supplier performance, track pricing trends, and identify demand for copper products, enabling better decision-making for trade and market expansion for Vietnam copper imports from japan under HS code 38 via Port Tien-s-inland-port-authorityheyn.
Businesses can identify key importers, evaluate supplier competitiveness, track pricing trends, and analyze demand for specific rubber products to make strategic sourcing and expansion decisions.
Importers, exporters, traders, manufacturers, and market analysts can use this data to understand trade patterns, optimize supply chains, identify potential partners, and gain a competitive advantage in the copper market.
