Live export data of Vietnam export to korea (republic) under the HS code 85429000 via port Tien s inland port authorityheyn, our Vietnam customs export data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam exporters data
Date |
HS Code |
Product Description |
Destination Country |
Custom Name |
QTY. |
Unit |
Value($) |
Exporter Name |
|---|---|---|---|---|---|---|---|---|
|
April 5, 2024 |
85429000 |
Electronic chip on the circuit board of the surveillance camera. 100% new product#&VN |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
1200 |
PCE |
450 |
Exporter Name |
|
April 12, 2024 |
85429000 |
SP3330D#&Battery dedicated electronic circuit part, Model SP3330D. 100% new product#&VN |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
255 |
PCE |
292.4085 |
Exporter Name |
|
April 12, 2024 |
85429000 |
Camera's infrared circuit board, electronic components assembled. 100% new product #&KR |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
10 |
PCE |
303.37 |
Exporter Name |
|
April 15, 2024 |
85429000 |
SHG56AF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56AF30001, CSP process, 100% new TX 1 part DH 4 TK 106172762510/E11#&KR |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
202 |
PCE |
1.616 |
Exporter Name |
|
April 15, 2024 |
85429000 |
SHG56BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56BA00001, CSP process, 100% new TX 1 part DH 4 TK 105921068960/E11#&KR |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
1893 |
PCE |
15.144 |
Exporter Name |
|
April 15, 2024 |
85429000 |
SDG45EA40001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SDG45EA40001, CSP process, 100% new TX 1 part DH 1 TK 106134136030/E11#&KR |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
89462 |
PCE |
805.158 |
Exporter Name |
|
April 15, 2024 |
85429000 |
SH806BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SH806BA00001, CSP process, 100% new TX 1 part DH 9 TK 106134136030/E11#&KR |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
21957 |
PCE |
197.613 |
Exporter Name |
|
April 15, 2024 |
85429000 |
SHG89BF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG89BF30001, CSP process, 100% new TX 1 part DH 8 TK 106124093610/E11#&KR |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
140278 |
PCE |
1262.502 |
Exporter Name |
|
April 15, 2024 |
85429000 |
SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
13151 |
PCE |
131.51 |
Exporter Name |
|
April 15, 2024 |
85429000 |
SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR |
Korea (Republic) | Tien S Inland Port AuthorityHeyn |
40944 |
PCE |
409.44 |
Exporter Name |
2024-04-05 00:00:00
Electronic chip on the circuit board of the surveillance camera. 100% new product#&VN
1200
PCE
450
2024-04-12 00:00:00
SP3330D#&Battery dedicated electronic circuit part, Model SP3330D. 100% new product#&VN
255
PCE
292.4085
2024-04-12 00:00:00
Camera's infrared circuit board, electronic components assembled. 100% new product #&KR
10
PCE
303.37
2024-04-15 00:00:00
SHG56AF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56AF30001, CSP process, 100% new TX 1 part DH 4 TK 106172762510/E11#&KR
202
PCE
1.616
2024-04-15 00:00:00
SHG56BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56BA00001, CSP process, 100% new TX 1 part DH 4 TK 105921068960/E11#&KR
1893
PCE
15.144
2024-04-15 00:00:00
SDG45EA40001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SDG45EA40001, CSP process, 100% new TX 1 part DH 1 TK 106134136030/E11#&KR
89462
PCE
805.158
2024-04-15 00:00:00
SH806BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SH806BA00001, CSP process, 100% new TX 1 part DH 9 TK 106134136030/E11#&KR
21957
PCE
197.613
2024-04-15 00:00:00
SHG89BF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG89BF30001, CSP process, 100% new TX 1 part DH 8 TK 106124093610/E11#&KR
140278
PCE
1262.502
2024-04-15 00:00:00
SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR
13151
PCE
131.51
2024-04-15 00:00:00
SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR
40944
PCE
409.44
