Vietnam Customs export data under HS code 854290 to korea (republic) via Port Tien s inland port authorityheyn

Live export data of Vietnam export to korea (republic) under the HS code 854290 via port Tien s inland port authorityheyn, our Vietnam customs export data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam exporters data

Date

HS Code

Product Description

Destination Country

Custom Name

QTY.

Unit

Value($)

Exporter Name

April 5, 2024

85429000

Electronic chip on the circuit board of the surveillance camera. 100% new product#&VN

Korea (Republic) Tien S Inland Port AuthorityHeyn

1200

PCE

450

Exporter Name

April 12, 2024

85429000

SP3330D#&Battery dedicated electronic circuit part, Model SP3330D. 100% new product#&VN

Korea (Republic) Tien S Inland Port AuthorityHeyn

255

PCE

292.4085

Exporter Name

April 12, 2024

85429000

Camera's infrared circuit board, electronic components assembled. 100% new product #&KR

Korea (Republic) Tien S Inland Port AuthorityHeyn

10

PCE

303.37

Exporter Name

April 15, 2024

85429000

SHG56AF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56AF30001, CSP process, 100% new TX 1 part DH 4 TK 106172762510/E11#&KR

Korea (Republic) Tien S Inland Port AuthorityHeyn

202

PCE

1.616

Exporter Name

April 15, 2024

85429000

SHG56BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56BA00001, CSP process, 100% new TX 1 part DH 4 TK 105921068960/E11#&KR

Korea (Republic) Tien S Inland Port AuthorityHeyn

1893

PCE

15.144

Exporter Name

April 15, 2024

85429000

SDG45EA40001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SDG45EA40001, CSP process, 100% new TX 1 part DH 1 TK 106134136030/E11#&KR

Korea (Republic) Tien S Inland Port AuthorityHeyn

89462

PCE

805.158

Exporter Name

April 15, 2024

85429000

SH806BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SH806BA00001, CSP process, 100% new TX 1 part DH 9 TK 106134136030/E11#&KR

Korea (Republic) Tien S Inland Port AuthorityHeyn

21957

PCE

197.613

Exporter Name

April 15, 2024

85429000

SHG89BF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG89BF30001, CSP process, 100% new TX 1 part DH 8 TK 106124093610/E11#&KR

Korea (Republic) Tien S Inland Port AuthorityHeyn

140278

PCE

1262.502

Exporter Name

April 15, 2024

85429000

SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR

Korea (Republic) Tien S Inland Port AuthorityHeyn

13151

PCE

131.51

Exporter Name

April 15, 2024

85429000

SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR

Korea (Republic) Tien S Inland Port AuthorityHeyn

40944

PCE

409.44

Exporter Name

Shipment No. 1

Date

2024-04-05 00:00:00

HS CODE

Product Description

Electronic chip on the circuit board of the surveillance camera. 100% new product#&VN

Destination Country

Unloading Port

QTY

1200

Unit

PCE

Value($)

450

Exporter Name

Shipment No. 2

Date

2024-04-12 00:00:00

HS CODE

Product Description

SP3330D#&Battery dedicated electronic circuit part, Model SP3330D. 100% new product#&VN

Destination Country

Unloading Port

QTY

255

Unit

PCE

Value($)

292.4085

Exporter Name

Shipment No. 3

Date

2024-04-12 00:00:00

HS CODE

Product Description

Camera's infrared circuit board, electronic components assembled. 100% new product #&KR

Destination Country

Unloading Port

QTY

10

Unit

PCE

Value($)

303.37

Exporter Name

Shipment No. 4

Date

2024-04-15 00:00:00

HS CODE

Product Description

SHG56AF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56AF30001, CSP process, 100% new TX 1 part DH 4 TK 106172762510/E11#&KR

Destination Country

Unloading Port

QTY

202

Unit

PCE

Value($)

1.616

Exporter Name

Shipment No. 5

Date

2024-04-15 00:00:00

HS CODE

Product Description

SHG56BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56BA00001, CSP process, 100% new TX 1 part DH 4 TK 105921068960/E11#&KR

Destination Country

Unloading Port

QTY

1893

Unit

PCE

Value($)

15.144

Exporter Name

Shipment No. 6

Date

2024-04-15 00:00:00

HS CODE

Product Description

SDG45EA40001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SDG45EA40001, CSP process, 100% new TX 1 part DH 1 TK 106134136030/E11#&KR

Destination Country

Unloading Port

QTY

89462

Unit

PCE

Value($)

805.158

Exporter Name

Shipment No. 7

Date

2024-04-15 00:00:00

HS CODE

Product Description

SH806BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SH806BA00001, CSP process, 100% new TX 1 part DH 9 TK 106134136030/E11#&KR

Destination Country

Unloading Port

QTY

21957

Unit

PCE

Value($)

197.613

Exporter Name

Shipment No. 8

Date

2024-04-15 00:00:00

HS CODE

Product Description

SHG89BF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG89BF30001, CSP process, 100% new TX 1 part DH 8 TK 106124093610/E11#&KR

Destination Country

Unloading Port

QTY

140278

Unit

PCE

Value($)

1262.502

Exporter Name

Shipment No. 9

Date

2024-04-15 00:00:00

HS CODE

Product Description

SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR

Destination Country

Unloading Port

QTY

13151

Unit

PCE

Value($)

131.51

Exporter Name

Shipment No. 10

Date

2024-04-15 00:00:00

HS CODE

Product Description

SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR

Destination Country

Unloading Port

QTY

40944

Unit

PCE

Value($)

409.44

Exporter Name

FAQs With Answers

Vietnam HS Code 854290 export data from korea-(republic) via Port Tien-s-inland-port-authorityheyn processing includes shipment-level details such as shipment date, product description, HS codes, quantity, value, country of origin & destination, port details, and importer-exporter information.

Vietnam export data from korea-(republic) under HS Code 854290 through this port is highly valuable for market research and business strategy. It enables companies to track demand trends for products under HS code 854290, identify key importers & competitors, analyze pricing patterns, and understand sourcing behavior. Businesses can use these insights to find new buyers, optimize supply chains, evaluate market entry opportunities, and make data-driven decisions to stay competitive in Vietnam’s export industry.

This data helps companies track Vietnam-korea-(republic) trade flows for products under HS code 854290, identify active importers, access port activities, analyze pricing trends, and discover sourcing or partnership opportunities in Vietnam’s market.

korea-(republic) is a key supplier due to its large-scale production capacity, competitive pricing, and strong integration with Vietnam’s manufacturing supply chains.

The database is regularly updated with recent shipment records, allowing businesses to access timely insights and monitor real-time trade activity.

Please select a country or provide either a description or HS Code.
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