Import Database of Vietnam Electronics Imports from Japan Under HS Code 38

Live electronics import data of Vietnam imports Data under HS code 38 from Japan, our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam electronics importers data. This detailed trade intelligence helps businesses analyze import trends, monitor competitor activities, & identify potential opportunities in Vietnam-Japan electronics trade under HS Code 38.

Vietnam

Verified Data of Vietnam Electronics Imports from Japan by HS Code 38

Date

HS Code

Product Description

Origin Country

Custom Name

QTY.

Unit

Value($)

Importer Name
2024-04-17 00:00:00
38101000
 		38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001 Japan Ha Nam Headquarters 85 KGM 7334.65 Importer Name
2024-04-17 00:00:00
38101000
 		38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031 Japan Ha Nam Headquarters 120 KGM 9994.8 Importer Name
2024-04-17 00:00:00
38101000
 		FY097#&Lead-free solder paste (S3X70-M500 SOLDER PASTE solder paste includes: 1. Tin 82-88% (7440-31-5), 2. Silver 2-3% (7440-22-4).. .,500G/bottle) used to connect components to electronic circuit boards,591.00054.005 Japan CCHQ Management of Bac Giang Industrial Parks 20 KGM 2131 Importer Name
2024-04-19 00:00:00
38101000
 		021-1182#&Soldering cream/Solder paste lead-free NP303-ZYA-1 Type 5 (Soldering cream used to produce electronic circuit boards, Cas No:7440-31-5(85.4%),7440-22-4(2.7 %),7440-50-8(0.44%) (*),1pc=1 jar (500gram), 100% new) Japan Vietnam Singapore Industrial Park Authority 160 PCE 10192 Importer Name
2024-04-19 00:00:00
38101000
 		PCB-SS0000019AA#&Solder paste (solder paste) includes metal and other materials used to solder electronic components onto printed circuit boards, HEE LFM 48W TM-HP, 100% new, type SS0000019AA Japan CCHQ KCEP and IP 80 KGM 6585.516 Importer Name
2024-04-19 00:00:00
38109000
 		NL014#&Solder paste (GT-30) used in the production of electronic circuit boards. New 100% Japan CCHQ KCEP and IP 90 KGM 12600 Importer Name
2024-04-19 00:00:00
38249999
 		CM-00048#&CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25%, has the effect of improving adhesion and product surface quality, in electronic circuit board production Japan CCHQ Bac Thang Long Industrial Park 1920 LTR 13843.2 Importer Name
2024-04-22 00:00:00
38101000
 		Solder paste LFM-48W NH(IMT) -A 11.5% for soldering electronic circuit boards, TP: Sn CAS 7440-31-5(85.40%), Ag CAS 7440-22-4(2.66%), Cu CAS 7440-50-8 (0.44%), Rosin 8050-09-7(5.75%),... Japan CCHQ Top ManagementUh processing 100 KGM 7977 Importer Name
2024-04-22 00:00:00
38101000
 		Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 30 KGM 2430 Importer Name
2024-04-22 00:00:00
38101000
 		Soldering paste S3X58-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 10 KGM 752 Importer Name

Shipment No. 1

Date

2024-04-17 00:00:00

HS CODE

38101000

Product Description

38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001

Origin Country

Japan

Unloading Port

Ha Nam Headquarters

QTY

85

Unit

KGM

Value($)

7334.65

Importer Name

Importer Name

Shipment No. 2

Date

2024-04-17 00:00:00

HS CODE

38101000

Product Description

38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031

Origin Country

Japan

Unloading Port

Ha Nam Headquarters

QTY

120

Unit

KGM

Value($)

9994.8

Importer Name

Importer Name

Shipment No. 3

Date

2024-04-17 00:00:00

HS CODE

38101000

Product Description

FY097#&Lead-free solder paste (S3X70-M500 SOLDER PASTE solder paste includes: 1. Tin 82-88% (7440-31-5), 2. Silver 2-3% (7440-22-4).. .,500G/bottle) used to connect components to electronic circuit boards,591.00054.005

Origin Country

Japan

Unloading Port

CCHQ Management of Bac Giang Industrial Parks

QTY

20

Unit

KGM

Value($)

2131

Importer Name

Importer Name

Shipment No. 4

Date

2024-04-19 00:00:00

HS CODE

38101000

Product Description

021-1182#&Soldering cream/Solder paste lead-free NP303-ZYA-1 Type 5 (Soldering cream used to produce electronic circuit boards, Cas No:7440-31-5(85.4%),7440-22-4(2.7 %),7440-50-8(0.44%) (*),1pc=1 jar (500gram), 100% new)

Origin Country

Japan

Unloading Port

Vietnam Singapore Industrial Park Authority

QTY

160

Unit

PCE

Value($)

10192

Importer Name

Importer Name

Shipment No. 5

Date

2024-04-19 00:00:00

HS CODE

38101000

Product Description

PCB-SS0000019AA#&Solder paste (solder paste) includes metal and other materials used to solder electronic components onto printed circuit boards, HEE LFM 48W TM-HP, 100% new, type SS0000019AA

Origin Country

Japan

Unloading Port

CCHQ KCEP and IP

QTY

80

Unit

KGM

Value($)

6585.516

Importer Name

Importer Name

Shipment No. 6

Date

2024-04-19 00:00:00

HS CODE

38109000

Product Description

NL014#&Solder paste (GT-30) used in the production of electronic circuit boards. New 100%

Origin Country

Japan

Unloading Port

CCHQ KCEP and IP

QTY

90

Unit

KGM

Value($)

12600

Importer Name

Importer Name

Shipment No. 7

Date

2024-04-19 00:00:00

HS CODE

38249999

Product Description

CM-00048#&CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25%, has the effect of improving adhesion and product surface quality, in electronic circuit board production

Origin Country

Japan

Unloading Port

CCHQ Bac Thang Long Industrial Park

QTY

1920

Unit

LTR

Value($)

13843.2

Importer Name

Importer Name

Shipment No. 8

Date

2024-04-22 00:00:00

HS CODE

38101000

Product Description

Solder paste LFM-48W NH(IMT) -A 11.5% for soldering electronic circuit boards, TP: Sn CAS 7440-31-5(85.40%), Ag CAS 7440-22-4(2.66%), Cu CAS 7440-50-8 (0.44%), Rosin 8050-09-7(5.75%),...

Origin Country

Japan

Unloading Port

CCHQ Top ManagementUh processing

QTY

100

Unit

KGM

Value($)

7977

Importer Name

Importer Name

Shipment No. 9

Date

2024-04-22 00:00:00

HS CODE

38101000

Product Description

Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Japan

Unloading Port

Tien S Inland Port AuthorityHeyn

QTY

30

Unit

KGM

Value($)

2430

Importer Name

Importer Name

Shipment No. 10

Date

2024-04-22 00:00:00

HS CODE

38101000

Product Description

Soldering paste S3X58-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Japan

Unloading Port

Tien S Inland Port AuthorityHeyn

QTY

10

Unit

KGM

Value($)

752

Importer Name

Importer Name

HS Code

Origin Country

Unloading Port

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