Vietnam Customs Import Data of electronics Imports from japan under HS Code 38 via Port Tien-s-inland-port-authorityheyn

Live Electronics Import data of Vietnam imports from japan under HS Code 38 via Port Tien-s-inland-port-authorityheyn , our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam electronics importers data

Date

HS Code

Product Description

Origin Country

Custom Name

QTY.

Unit

Value($)

Importer Name

2024-04-22 00:00:00
38101000
Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 30 KGM 2430 Importer Name
2024-04-22 00:00:00
38101000
Soldering paste S3X58-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 10 KGM 752 Importer Name
2024-04-01 00:00:00
38101000
Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 35 KGM 2597 Importer Name
2024-04-01 00:00:00
38101000
Soldering paste S3X58-A340, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 90 KGM 6678 Importer Name
2024-04-01 00:00:00
38101000
Soldering paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 140 KGM 10920 Importer Name
2024-04-15 00:00:00
38101000
Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 10 KGM 810 Importer Name
2024-04-22 00:00:00
38101000
Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 100 KGM 7420 Importer Name
2024-04-22 00:00:00
38101000
Soldering paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% Japan Tien S Inland Port AuthorityHeyn 470 KGM 36660 Importer Name

Shipment No. 1

Date

2024-04-22 00:00:00

HS CODE

Product Description

Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

30

Unit

KGM

Value($)

2430

Importer Name

Shipment No. 2

Date

2024-04-22 00:00:00

HS CODE

Product Description

Soldering paste S3X58-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

10

Unit

KGM

Value($)

752

Importer Name

Shipment No. 3

Date

2024-04-01 00:00:00

HS CODE

Product Description

Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

35

Unit

KGM

Value($)

2597

Importer Name

Shipment No. 4

Date

2024-04-01 00:00:00

HS CODE

Product Description

Soldering paste S3X58-A340, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

90

Unit

KGM

Value($)

6678

Importer Name

Shipment No. 5

Date

2024-04-01 00:00:00

HS CODE

Product Description

Soldering paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

140

Unit

KGM

Value($)

10920

Importer Name

Shipment No. 6

Date

2024-04-15 00:00:00

HS CODE

Product Description

Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

10

Unit

KGM

Value($)

810

Importer Name

Shipment No. 7

Date

2024-04-22 00:00:00

HS CODE

Product Description

Soldering paste S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

100

Unit

KGM

Value($)

7420

Importer Name

Shipment No. 8

Date

2024-04-22 00:00:00

HS CODE

Product Description

Soldering paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100%

Origin Country

Unloading Port

QTY

470

Unit

KGM

Value($)

36660

Importer Name

FAQs With Answers

The database includes shipment-level information such as shipment date, HS code, product description, quantity, value, port details, country of origin & destination, & importer-exporter information for accurate trade analysis of products under HS code 38 for Vietnam electronics imports from Thailand via Port Tien-s-inland-port-authorityheyn.

Port Tien-s-inland-port-authorityheyn typically refers to a port that is used for handling and forwarding shipments into Vietnam, making it important for tracking inland and cross-border trade flows.

It helps businesses understand sourcing patterns, evaluate supplier performance, track pricing trends, and identify demand for electronics products, enabling better decision-making for trade and market expansion for Vietnam electronics imports from japan under HS code 38 via Port Tien-s-inland-port-authorityheyn.

Businesses can identify key importers, evaluate supplier competitiveness, track pricing trends, and analyze demand for specific rubber products to make strategic sourcing and expansion decisions.

Importers, exporters, traders, manufacturers, and market analysts can use this data to understand trade patterns, optimize supply chains, identify potential partners, and gain a competitive advantage in the electronics market.

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