| Jul-24 |
38180090
|
Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have
|
Germany
|
442
|
KILOGRAM
|
187116
|
| Jul-24 |
38180090
|
Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have
|
China
|
2
|
KILOGRAM
|
2099
|
| Jul-24 |
38180010
|
Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
|
United States
|
2341
|
KILOGRAM
|
8862003
|
| Jul-24 |
38180010
|
Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
|
United Kingdom
|
52
|
KILOGRAM
|
64228
|
| Jul-24 |
38180010
|
Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
|
Korea, Republic of
|
4838
|
KILOGRAM
|
2791938
|
| Jul-24 |
38180010
|
Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
|
France
|
711
|
KILOGRAM
|
2269906
|
| Jul-24 |
38180090
|
Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have
|
United States
|
20
|
KILOGRAM
|
131570
|
| Jul-24 |
38180090
|
Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have
|
United Kingdom
|
1
|
KILOGRAM
|
1698
|
| Jul-24 |
38180010
|
Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
|
Japan
|
12838
|
KILOGRAM
|
2468716
|
| Jul-24 |
38180090
|
Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have
|
France
|
120
|
KILOGRAM
|
567201
|
