Date |
HS Code |
Product Description |
Origin Country |
Unloading Port |
QTY. |
Unit |
Value($) |
|---|---|---|---|---|---|---|---|
| Nov, 2024 |
381800010
|
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Silicon doped for use in electronics, in the form of discs, wafers or similar forms | United States of America | Osaka Sakai | 369 | KG | 823.28 |
| Nov, 2024 |
381800020
|
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Other | United States of America | Osaka Sakai | 3 | KG | 88.57 |
| Nov, 2024 |
382499200
|
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Derivatives of mixtures of fatty acids | United States of America | Osaka | 3280 | KG | 14.69 |
Nov, 2024
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Silicon doped for use in electronics, in the form of discs, wafers or similar forms
369
KG
823.28
Nov, 2024
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Other
3
KG
88.57
Nov, 2024
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Derivatives of mixtures of fatty acids
3280
KG
14.69
