Date |
HS Code |
Product Description |
Origin Country |
Unloading Port |
QTY. |
Unit |
Value($) |
|---|---|---|---|---|---|---|---|
| Nov, 2024 |
381800010
|
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Silicon doped for use in electronics, in the form of discs, wafers or similar forms | Singapore | Osaka Sakai | 15 | KG | 22.43 |
| Nov, 2024 |
382499200
|
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Derivatives of mixtures of fatty acids | Singapore | Osaka | 14400 | KG | 70.51 |
Nov, 2024
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Silicon doped for use in electronics, in the form of discs, wafers or similar forms
15
KG
22.43
Nov, 2024
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Derivatives of mixtures of fatty acids
14400
KG
70.51
