Date |
HS Code |
Product Description |
Origin Country |
Unloading Port |
QTY. |
Unit |
Value($) |
|---|---|---|---|---|---|---|---|
| Nov, 2024 |
381800010
|
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Silicon doped for use in electronics, in the form of discs, wafers or similar forms | Republic of Korea | Osaka Sakai | 22 | KG | 1.74 |
| Nov, 2024 |
382499999
|
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Other: Other: Other: Other | Republic of Korea | Osaka Sakai | 11 | KG | 5.56 |
Nov, 2024
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Silicon doped for use in electronics, in the form of discs, wafers or similar forms
22
KG
1.74
Nov, 2024
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Other: Other: Other: Other
11
KG
5.56
