Date |
HS Code |
Product Description |
Origin Country |
Unloading Port |
QTY. |
Unit |
Value($) |
|---|---|---|---|---|---|---|---|
| Nov, 2024 |
381800020
|
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Other | France | Tokyo | 4 | KG | 5.44 |
| Nov, 2024 |
382499200
|
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Derivatives of mixtures of fatty acids | France | Tokyo | 2280 | KG | 7.46 |
| Nov, 2024 |
382499999
|
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Other: Other: Other: Other | France | Tokyo | 48016 | KG | 243.34 |
Nov, 2024
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Derivatives of mixtures of fatty acids
2280
KG
7.46
Nov, 2024
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Other: Other: Other: Other
48016
KG
243.34
