Vietnam Customs import data under HS code 85429000 from korea (republic) via Port Tien son inland port authority

Live import data of Vietnam import from korea (republic) under the HS code 85429000 via port Tien son inland port authority, our Vietnam customs import data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam importers data

vietnam
Date

HS Code

Product Description

Origin Country

Custom Name

QTY.

Unit

Value($)

Importer Name
2024-04-01 00:00:00
85429000
 		SRG00EGH0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SRG00EGH0001, CSP process, 100% new Korea (Republic) Tien Son Inland Port Authority 117428 PCE 1174.28 Importer Name
2024-04-01 00:00:00
85429000
 		SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new Korea (Republic) Tien Son Inland Port Authority 368496 PCE 3684.96 Importer Name
2024-04-01 00:00:00
85429000
 		SDG35BGN0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SDG35BGN0001, CSP process, 100% new Korea (Republic) Tien Son Inland Port Authority 436240 PCE 4798.64 Importer Name
2024-04-01 00:00:00
85429000
 		SHG93AGK0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SHG93AGK0001, CSP process, 100% new Korea (Republic) Tien Son Inland Port Authority 17294 PCE 190.234 Importer Name
2024-04-01 00:00:00
85429000
 		SHG93AGK0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SHG93AGK0001, CSP process, 100% new Korea (Republic) Tien Son Inland Port Authority 51882 PCE 570.702 Importer Name
2024-04-01 00:00:00
85429000
 		SHG93AGK0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SHG93AGK0001, CSP process, 100% new Korea (Republic) Tien Son Inland Port Authority 103764 PCE 1141.404 Importer Name
2024-04-01 00:00:00
85429000
 		SDG93HGS0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SDG93HGS0001, CSP process, 100% new Korea (Republic) Tien Son Inland Port Authority 146262 PCE 1755.144 Importer Name
2024-04-01 00:00:00
85429000
 		SHG60BA00003#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SHG60BA00003, CSP process, 100% new Korea (Republic) Tien Son Inland Port Authority 486960 PCE 5843.52 Importer Name
2024-04-01 00:00:00
85429000
 		SHG93AXQ0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG93AXQ0H01), WLP process, 100% new Korea (Republic) Tien Son Inland Port Authority 337663 PCE 4051.956 Importer Name
2024-04-01 00:00:00
85429000
 		SWG42BGA0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SWG42BGA0001, CSP process, 100% new Korea (Republic) Tien Son Inland Port Authority 920740 PCE 11969.62 Importer Name

Shipment No. 1

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SRG00EGH0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SRG00EGH0001, CSP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

117428

Unit

PCE

Value($)

1174.28

Importer Name

Importer Name

Shipment No. 2

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

368496

Unit

PCE

Value($)

3684.96

Importer Name

Importer Name

Shipment No. 3

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SDG35BGN0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SDG35BGN0001, CSP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

436240

Unit

PCE

Value($)

4798.64

Importer Name

Importer Name

Shipment No. 4

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SHG93AGK0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SHG93AGK0001, CSP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

17294

Unit

PCE

Value($)

190.234

Importer Name

Importer Name

Shipment No. 5

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SHG93AGK0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SHG93AGK0001, CSP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

51882

Unit

PCE

Value($)

570.702

Importer Name

Importer Name

Shipment No. 6

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SHG93AGK0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SHG93AGK0001, CSP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

103764

Unit

PCE

Value($)

1141.404

Importer Name

Importer Name

Shipment No. 7

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SDG93HGS0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SDG93HGS0001, CSP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

146262

Unit

PCE

Value($)

1755.144

Importer Name

Importer Name

Shipment No. 8

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SHG60BA00003#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SHG60BA00003, CSP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

486960

Unit

PCE

Value($)

5843.52

Importer Name

Importer Name

Shipment No. 9

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SHG93AXQ0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG93AXQ0H01), WLP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

337663

Unit

PCE

Value($)

4051.956

Importer Name

Importer Name

Shipment No. 10

Date

2024-04-01 00:00:00

HS CODE

85429000

Product Description

SWG42BGA0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SWG42BGA0001, CSP process, 100% new

Origin Country

Korea (Republic)

Unloading Port

Tien Son Inland Port Authority

QTY

920740

Unit

PCE

Value($)

11969.62

Importer Name

Importer Name

HS Code

Origin Country

Unloading Port

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