Live import data of Vietnam import from korea (republic) under the HS code 85340030 via port Cchq bac ninh, our Vietnam customs import data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-01 00:00:00 |
85340030
|
DAPPEDP0041#&Multi-layer printed circuit without components used in the production of mobile phones, model: (R0.2)SM-G736B USB PBA(XcoverPro2) | Korea (Republic) | CCHQ Bac Ninh | 3000 | PCE | 1068.45 | Importer Name |
| 2024-04-01 00:00:00 |
85340030
|
WTJPEDP0105#&Multi-layer flexible printed circuit without components, model: (R0.3)SM-A556B FRC+SUB PBA(S/K) | Korea (Republic) | CCHQ Bac Ninh | 639776 | PCE | 86337.7712 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
MB11-446A#&Multi-layer printed circuit without electronic components installed MB11-446A/VESTA 13 | Korea (Republic) | CCHQ Bac Ninh | 2625 | PCE | 2894.0625 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
MB11-450A#&Multi-layer printed circuit without electronic components installed MB11-450A/Vesta4-15 | Korea (Republic) | CCHQ Bac Ninh | 1150 | PCE | 2169.36 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB632FG01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 273x110mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 5 | PCE | 1050 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB675FH01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 163x167mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 12 | PCE | 2520 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB629FF01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 100x268mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 10 | PCE | 2100 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB625GR01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 76x285mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 16 | PCE | 3360 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB338EH01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 110x275mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 45 | PCE | 9450 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
Multi-layer electrostatic printed circuit board A233 R-> T PJT R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Size: 300x110mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 20 | PCE | 4520 | Importer Name |
2024-04-01 00:00:00
DAPPEDP0041#&Multi-layer printed circuit without components used in the production of mobile phones, model: (R0.2)SM-G736B USB PBA(XcoverPro2)
3000
PCE
1068.45
2024-04-01 00:00:00
WTJPEDP0105#&Multi-layer flexible printed circuit without components, model: (R0.3)SM-A556B FRC+SUB PBA(S/K)
639776
PCE
86337.7712
2024-04-02 00:00:00
MB11-446A#&Multi-layer printed circuit without electronic components installed MB11-446A/VESTA 13
2625
PCE
2894.0625
2024-04-02 00:00:00
MB11-450A#&Multi-layer printed circuit without electronic components installed MB11-450A/Vesta4-15
1150
PCE
2169.36
2024-04-02 00:00:00
AMB632FG01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 273x110mm. New 100%
5
PCE
1050
2024-04-02 00:00:00
AMB675FH01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 163x167mm. New 100%
12
PCE
2520
2024-04-02 00:00:00
AMB629FF01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 100x268mm. New 100%
10
PCE
2100
2024-04-02 00:00:00
AMB625GR01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 76x285mm. New 100%
16
PCE
3360
2024-04-02 00:00:00
AMB338EH01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 110x275mm. New 100%
45
PCE
9450
2024-04-02 00:00:00
Multi-layer electrostatic printed circuit board A233 R-> T PJT R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Size: 300x110mm. New 100%
20
PCE
4520
