Live Mobile-phone Import data of Vietnam imports from korea-(republic) under HS Code 853400 via Port Cchq-bac-ninh , our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam mobile-phone importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-01 00:00:00 |
85340030
|
DAPPEDP0041#&Multi-layer printed circuit without components used in the production of mobile phones, model: (R0.2)SM-G736B USB PBA(XcoverPro2) | Korea (Republic) | CCHQ Bac Ninh | 3000 | PCE | 1068.45 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB632FG01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 273x110mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 5 | PCE | 1050 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB675FH01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 163x167mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 12 | PCE | 2520 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB629FF01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 100x268mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 10 | PCE | 2100 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB625GR01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 76x285mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 16 | PCE | 3360 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB338EH01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 110x275mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 45 | PCE | 9450 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
Multi-layer electrostatic printed circuit board A233 R-> T PJT R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Size: 300x110mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 20 | PCE | 4520 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
Multi-layer electrostatic printed circuit board AMB627EF01 R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Dimensions: 305x110mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 20 | PCE | 4520 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
A252 DOE N_D MAIN UPPER Ver.Si Coating multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 290x78mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 2 | PCE | 492 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB632FG01 R_OCA multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 72x277mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 3 | PCE | 810 | Importer Name |
2024-04-01 00:00:00
DAPPEDP0041#&Multi-layer printed circuit without components used in the production of mobile phones, model: (R0.2)SM-G736B USB PBA(XcoverPro2)
3000
PCE
1068.45
2024-04-02 00:00:00
AMB632FG01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 273x110mm. New 100%
5
PCE
1050
2024-04-02 00:00:00
AMB675FH01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 163x167mm. New 100%
12
PCE
2520
2024-04-02 00:00:00
AMB629FF01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 100x268mm. New 100%
10
PCE
2100
2024-04-02 00:00:00
AMB625GR01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 76x285mm. New 100%
16
PCE
3360
2024-04-02 00:00:00
AMB338EH01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 110x275mm. New 100%
45
PCE
9450
2024-04-02 00:00:00
Multi-layer electrostatic printed circuit board A233 R-> T PJT R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Size: 300x110mm. New 100%
20
PCE
4520
2024-04-02 00:00:00
Multi-layer electrostatic printed circuit board AMB627EF01 R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Dimensions: 305x110mm. New 100%
20
PCE
4520
2024-04-02 00:00:00
A252 DOE N_D MAIN UPPER Ver.Si Coating multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 290x78mm. New 100%
2
PCE
492
2024-04-02 00:00:00
AMB632FG01 R_OCA multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 72x277mm. New 100%
3
PCE
810
The database includes shipment-level information such as shipment date, HS code, product description, quantity, value, port details, country of origin & destination, & importer-exporter information for accurate trade analysis of products under HS code 853400 for Vietnam mobile-phone imports from Thailand via Port Cchq-bac-ninh.
Port Cchq-bac-ninh typically refers to a port that is used for handling and forwarding shipments into Vietnam, making it important for tracking inland and cross-border trade flows.
It helps businesses understand sourcing patterns, evaluate supplier performance, track pricing trends, and identify demand for mobile-phone products, enabling better decision-making for trade and market expansion for Vietnam mobile-phone imports from korea-(republic) under HS code 853400 via Port Cchq-bac-ninh.
Businesses can identify key importers, evaluate supplier competitiveness, track pricing trends, and analyze demand for specific rubber products to make strategic sourcing and expansion decisions.
Importers, exporters, traders, manufacturers, and market analysts can use this data to understand trade patterns, optimize supply chains, identify potential partners, and gain a competitive advantage in the mobile-phone market.
