vietnam Customs Export Data of copper-wire Exports to vietnam under HS Code 38 via Port Vinh-phuc-headquarters

Live Copper-wire Export data of Vietnam exports to vietnam under HS Code 38 via Port Vinh-phuc-headquarters , our Vietnam customs export data reports include date, value, quantity, product description, HS code, port, country, and Vietnam copper-wire exporters data

Date

HS Code

Product Description

Destination Country

Custom Name

QTY.

Unit

Value($)

Exporter Name

April 26, 2024

38249999

Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-430PK (Sodium chloride 18-23%, Hydrogen chloride 1-4%, Additive <1%, water 72-81%). 100% new product #&KR

VIETNAM Vinh Phuc Headquarters

7800

KGM

11403.132

Exporter Name

April 26, 2024

38249999

Additive in circuit board plating process ORC-813M (Copper(II) sulfate, pentahydrate less than 1%, Sulfuric acid less than 1%, Water 85-94%). 100% new#&KR

VIETNAM Vinh Phuc Headquarters

200

KGM

4393.072

Exporter Name

April 26, 2024

38249999

Non-electrolytic copper plating additive in PCB circuit board plating: ORC-410RF (Monoethanolamine 20-26%, Nonylphenol polyethylene glycol ether 5-10%, 2-Propanol 1-5%, Ethylene glycol 2-6%,.). 100% new (liquid)#&KR

VIETNAM Vinh Phuc Headquarters

200

KGM

805.476

Exporter Name

April 26, 2024

38249999

Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-448 (Tin chloride dihydrate 10-18%,Palladium dichloride <1%,Hydrogen chloride 1-5%,Additive 15-22%,water 60-68 %). 100% new product #&KR

VIETNAM Vinh Phuc Headquarters

160

KGM

19395.2464

Exporter Name

April 26, 2024

38249999

Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-465A (Copper(II) sulfate, pentahydrate 12-20%, Formaldehyde 3-9%, Additive 4-8%, water 68-77%). 100% new product #&KR

VIETNAM Vinh Phuc Headquarters

10800

KGM

23705.136

Exporter Name

April 22, 2024

3824999990

Copper plating additive HVF EL-CU A H1 contains Sulfuric Acid 3+/- 2%, Copper(II) sulfate 15 +/-5%, nickel sulfate, hexahydrate <1%, the remainder is water. 20l/can. 100% new product #&KR

VIETNAM Vinh Phuc Headquarters

660

LTR

2164.8

Exporter Name

April 22, 2024

3824999990

HVF EL-CU M H2: Copper plating additive contains Sodium hydroxide 10+/-2%, nickel sulfate, hexahydrate 0.5+/-0.4%, the remainder is water. 20l/can. 100% new#&KR

VIETNAM Vinh Phuc Headquarters

600

LTR

3018

Exporter Name

April 22, 2024

3824999990

HVF EL-Cu S H3: Copper plating solution contains 2,2'-Bipyridyl 0.5+/-0.4%, the remainder is water. 20l/can, 100% New #&KR

VIETNAM Vinh Phuc Headquarters

160

LTR

734.4

Exporter Name

April 22, 2024

3824999990

HVF PRE-DIP 10 chemical contains sodium hydroxide 0.035 +/- 0.025%; D-GLUCOSE: 15 +/- 5%, used for anti-oxidation cleaning in copper plating. 20l/can. 100% new#&KR

VIETNAM Vinh Phuc Headquarters

100

LTR

394

Exporter Name

April 24, 2024

3824999990

Chemicals MJH H-CUPRUM A1(Copper(II)sulfate,pentahydrate17+-5%,Sulfuric acid 3+-2%,Nickel sulfate,hexahydrate0.5+-0.4%,Cobalt(II)sulfate heptahydrate 0.09+-0.07%. 20l/can. 100% new #&KR

VIETNAM Vinh Phuc Headquarters

2560

LTR

9794.5856

Exporter Name

Shipment No. 1

Date

2024-04-26 00:00:00

HS CODE

Product Description

Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-430PK (Sodium chloride 18-23%, Hydrogen chloride 1-4%, Additive <1%, water 72-81%). 100% new product #&KR

Destination Country

Unloading Port

QTY

7800

Unit

KGM

Value($)

11403.132

Exporter Name

Shipment No. 2

Date

2024-04-26 00:00:00

HS CODE

Product Description

Additive in circuit board plating process ORC-813M (Copper(II) sulfate, pentahydrate less than 1%, Sulfuric acid less than 1%, Water 85-94%). 100% new#&KR

Destination Country

Unloading Port

QTY

200

Unit

KGM

Value($)

4393.072

Exporter Name

Shipment No. 3

Date

2024-04-26 00:00:00

HS CODE

Product Description

Non-electrolytic copper plating additive in PCB circuit board plating: ORC-410RF (Monoethanolamine 20-26%, Nonylphenol polyethylene glycol ether 5-10%, 2-Propanol 1-5%, Ethylene glycol 2-6%,.). 100% new (liquid)#&KR

Destination Country

Unloading Port

QTY

200

Unit

KGM

Value($)

805.476

Exporter Name

Shipment No. 4

Date

2024-04-26 00:00:00

HS CODE

Product Description

Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-448 (Tin chloride dihydrate 10-18%,Palladium dichloride <1%,Hydrogen chloride 1-5%,Additive 15-22%,water 60-68 %). 100% new product #&KR

Destination Country

Unloading Port

QTY

160

Unit

KGM

Value($)

19395.2464

Exporter Name

Shipment No. 5

Date

2024-04-26 00:00:00

HS CODE

Product Description

Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-465A (Copper(II) sulfate, pentahydrate 12-20%, Formaldehyde 3-9%, Additive 4-8%, water 68-77%). 100% new product #&KR

Destination Country

Unloading Port

QTY

10800

Unit

KGM

Value($)

23705.136

Exporter Name

Shipment No. 6

Date

2024-04-22 00:00:00

HS CODE

Product Description

Copper plating additive HVF EL-CU A H1 contains Sulfuric Acid 3+/- 2%, Copper(II) sulfate 15 +/-5%, nickel sulfate, hexahydrate <1%, the remainder is water. 20l/can. 100% new product #&KR

Destination Country

Unloading Port

QTY

660

Unit

LTR

Value($)

2164.8

Exporter Name

Shipment No. 7

Date

2024-04-22 00:00:00

HS CODE

Product Description

HVF EL-CU M H2: Copper plating additive contains Sodium hydroxide 10+/-2%, nickel sulfate, hexahydrate 0.5+/-0.4%, the remainder is water. 20l/can. 100% new#&KR

Destination Country

Unloading Port

QTY

600

Unit

LTR

Value($)

3018

Exporter Name

Shipment No. 8

Date

2024-04-22 00:00:00

HS CODE

Product Description

HVF EL-Cu S H3: Copper plating solution contains 2,2'-Bipyridyl 0.5+/-0.4%, the remainder is water. 20l/can, 100% New #&KR

Destination Country

Unloading Port

QTY

160

Unit

LTR

Value($)

734.4

Exporter Name

Shipment No. 9

Date

2024-04-22 00:00:00

HS CODE

Product Description

HVF PRE-DIP 10 chemical contains sodium hydroxide 0.035 +/- 0.025%; D-GLUCOSE: 15 +/- 5%, used for anti-oxidation cleaning in copper plating. 20l/can. 100% new#&KR

Destination Country

Unloading Port

QTY

100

Unit

LTR

Value($)

394

Exporter Name

Shipment No. 10

Date

2024-04-24 00:00:00

HS CODE

Product Description

Chemicals MJH H-CUPRUM A1(Copper(II)sulfate,pentahydrate17+-5%,Sulfuric acid 3+-2%,Nickel sulfate,hexahydrate0.5+-0.4%,Cobalt(II)sulfate heptahydrate 0.09+-0.07%. 20l/can. 100% new #&KR

Destination Country

Unloading Port

QTY

2560

Unit

LTR

Value($)

9794.5856

Exporter Name

FAQs With Answers

The database includes shipment-level information such as shipment date, HS code, product description, quantity, value, port details, country of origin & destination, & importer-exporter information for accurate trade analysis of products under HS code 38 for Vietnam copper-wire imports from Thailand via Port Vinh-phuc-headquarters.

Port Vinh-phuc-headquarters typically refers to a port that is used for handling and forwarding shipments from Vietnam, making it important for tracking inland and cross-border trade flows.

It helps businesses understand sourcing patterns, evaluate supplier performance, track pricing trends, and identify demand for copper-wire products, enabling better decision-making for trade and market expansion for Vietnam copper-wire exports from vietnam under HS code 38 via Port Vinh-phuc-headquarters.

Businesses can identify key importers, evaluate supplier competitiveness, track pricing trends, and analyze demand for specific rubber products to make strategic sourcing and expansion decisions.

Importers, exporters, traders, manufacturers, and market analysts can use this data to understand trade patterns, optimize supply chains, identify potential partners, and gain a competitive advantage in the copper-wire market.

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