|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003. SLTT 0.153 KGM
|
China
|
CCHQ Hai Duhng
|
0.15
|
KGM
|
1.7385
|
Importer Name
|
|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003. SLTT 0.1672 KGM
|
China
|
CCHQ Hai Duhng
|
0.17
|
KGM
|
1.9703
|
Importer Name
|
|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003. SLTT 0.1144 KGM
|
China
|
CCHQ Hai Duhng
|
0.11
|
KGM
|
1.2749
|
Importer Name
|
|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003. SLTT 0.1672 KGM
|
China
|
CCHQ Hai Duhng
|
0.17
|
KGM
|
1.9703
|
Importer Name
|
|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003. SLTT 0.2816 KGM
|
China
|
CCHQ Hai Duhng
|
0.28
|
KGM
|
3.2452
|
Importer Name
|
|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003
|
China
|
CCHQ Hai Duhng
|
0.07
|
KGM
|
0.8113
|
Importer Name
|
|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003
|
China
|
CCHQ Hai Duhng
|
0.22
|
KGM
|
2.5498
|
Importer Name
|
|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003. SLTT 0.2268 KGM
|
China
|
CCHQ Hai Duhng
|
0.23
|
KGM
|
2.6657
|
Importer Name
|
|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003. SLTT 0.2268 KGM
|
China
|
CCHQ Hai Duhng
|
0.23
|
KGM
|
2.6657
|
Importer Name
|
|
2024-04-22 00:00:00
|
35069900
|
1.130000.8160003#&Silicone thermal conductive adhesive, used for electronic circuit boards, model: 1101, case number 9006-65-9,1344-28-1,1314-13-2, 100% new, 1.130000.8160003. SLTT 0.096 KGM
|
China
|
CCHQ Hai Duhng
|
0.1
|
KGM
|
1.159
|
Importer Name
|