Live import data of Vietnam import from korea (republic) under the HS code 85429000 via port Tien son inland port authority, our Vietnam customs import data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-01 00:00:00 |
85429000
|
SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 368496 | PCE | 3684.96 | Importer Name |
| 2024-04-01 00:00:00 |
85429000
|
SRG52ESL0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SRG52ESL0H01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 535392 | PCE | 8030.88 | Importer Name |
| 2024-04-01 00:00:00 |
85429000
|
SWG00AR20B02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SWG00AR20B02), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 235008 | PCE | 4700.16 | Importer Name |
| 2024-04-01 00:00:00 |
85429000
|
SH780AX30H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; SH780AX30H02), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 188808 | PCE | 4531.392 | Importer Name |
| 2024-04-01 00:00:00 |
85429000
|
SRG52AR50B01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SRG52AR50B01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 78336 | PCE | 2193.408 | Importer Name |
| 2024-04-01 00:00:00 |
85429000
|
SRG55DSE0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SRG55DSE0H01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 213225 | PCE | 5970.3 | Importer Name |
| 2024-04-01 00:00:00 |
85429000
|
SXG47CHG0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SXG47CHG0001, CSP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 1224258 | PCE | 36727.74 | Importer Name |
| 2024-04-01 00:00:00 |
85429000
|
SR806DX20H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; (SR806DX20H02), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 165072 | PCE | 5612.448 | Importer Name |
| 2024-04-01 00:00:00 |
85429000
|
SWG42AXU0H01#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SWG42AXU0H01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 1341685 | PCE | 49642.345 | Importer Name |
| 2024-04-01 00:00:00 |
85429000
|
SWG76ME60001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SWG76ME60001, CSP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 210270 | PCE | 7990.26 | Importer Name |
2024-04-01 00:00:00
SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new
368496
PCE
3684.96
2024-04-01 00:00:00
SRG52ESL0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SRG52ESL0H01), WLP process, 100% new
535392
PCE
8030.88
2024-04-01 00:00:00
SWG00AR20B02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SWG00AR20B02), WLP process, 100% new
235008
PCE
4700.16
2024-04-01 00:00:00
SH780AX30H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; SH780AX30H02), WLP process, 100% new
188808
PCE
4531.392
2024-04-01 00:00:00
SRG52AR50B01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SRG52AR50B01), WLP process, 100% new
78336
PCE
2193.408
2024-04-01 00:00:00
SRG55DSE0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SRG55DSE0H01), WLP process, 100% new
213225
PCE
5970.3
2024-04-01 00:00:00
SXG47CHG0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SXG47CHG0001, CSP process, 100% new
1224258
PCE
36727.74
2024-04-01 00:00:00
SR806DX20H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; (SR806DX20H02), WLP process, 100% new
165072
PCE
5612.448
2024-04-01 00:00:00
SWG42AXU0H01#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SWG42AXU0H01), WLP process, 100% new
1341685
PCE
49642.345
2024-04-01 00:00:00
SWG76ME60001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SWG76ME60001, CSP process, 100% new
210270
PCE
7990.26
