Live export data of Vietnam export to korea (republic) under the HS code 85340090 via port Vinh phuc headquarters, our Vietnam customs export data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam exporters data
Date |
HS Code |
Product Description |
Destination Country |
Custom Name |
QTY. |
Unit |
Value($) |
Exporter Name |
|---|---|---|---|---|---|---|---|---|
|
April 1, 2024 |
85340090 |
3150675A005#&Printed circuit board MASS/LP156WFJ-SPB1 (6850L-0638B)/MARKING 1, (cdsx: Circuit design, hot pressing, stamping and cutting products, air washing, bonded, product packaging)#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
19440 |
PCE |
1524.096 |
Exporter Name |
|
April 1, 2024 |
85340090 |
3150403-B1#&Printed circuit board MASS/LP140WF5-SPL1-5PJ (6850L-1992B)/MARKING 1 REV B1, (cdsx: hardening paste, hot pressing, seamless welding, drying, air washing, bonded , packaged product#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
35616 |
PCE |
3828.72 |
Exporter Name |
|
April 1, 2024 |
85340090 |
3150699A002#&Printed circuit board MASS/LP140WUA-SPB1 (6850L-2511A)/MARKING 1, (cdsx: Circuit design, hot pressing, stamping and cutting products, air washing, bonded, product packaging)#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
6300 |
PCE |
708.75 |
Exporter Name |
|
April 1, 2024 |
85340090 |
3150463-B0#&Printed circuit board MASS/LA123WF5-SL01-E21(6850L-1702D)/MARKING 1 REV B0 (cdsx: gluing hardening material, hot pressing, circuit sealing, drying, air washing, foreign sealing) packaging, product packaging)#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
18000 |
PCE |
2979 |
Exporter Name |
|
April 1, 2024 |
85340090 |
J180011-C1#&Printed circuit board MASS/JFPCX061 (JDI W6J-CS HINGE)/MARKING 1 REV C1, (cdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, sealing) package sp)#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
77850 |
PCE |
15056.19 |
Exporter Name |
|
April 1, 2024 |
85340090 |
3150547-B1#&Printed circuit board MASS/LA149QH1-FPC(6850L-2272A)/MARKING 1 REV B1, (cdsx: hardening paste, hot pressing, seamless welding, drying, air washing, bonded, sealing) package sp)#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
30656 |
PCE |
12663.9936 |
Exporter Name |
|
April 1, 2024 |
85340090 |
3150528-B7#&Printed circuit board LA103WF5-SL02 (6850L-2237A), (cdsx: hardening paste, hot pressing, seamless welding, drying, air washing, bonded, packaging)#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
5400 |
PCE |
7212.78 |
Exporter Name |
|
April 1, 2024 |
85340090 |
3150559-B1#&Printed circuit board MASS/LA123WF7-SL02 (6850L-2277A)/MARKING 1 REV B1, (hardening material paste, hot pressing, seamless sealing, drying, air washing, bonded, packaging sp)#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
6390 |
PCE |
10465.542 |
Exporter Name |
|
April 1, 2024 |
85340090 |
3150545-B4#&Printed circuit board LA080WH1-SL01 (6850L-2273A), (cdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, packaging)#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
4248 |
PCE |
7346.0664 |
Exporter Name |
|
April 1, 2024 |
85340090 |
3150554-B2#&Printed circuit board LA080WH1-SL02 (6850L-2289A), (stiffening paste, hot pressing, seamless sealing, drying, air washing, bonded, packaging)#&VN |
Korea (Republic) | Vinh Phuc Headquarters |
3240 |
PCE |
5954.148 |
Exporter Name |
2024-04-01 00:00:00
3150675A005#&Printed circuit board MASS/LP156WFJ-SPB1 (6850L-0638B)/MARKING 1, (cdsx: Circuit design, hot pressing, stamping and cutting products, air washing, bonded, product packaging)#&VN
19440
PCE
1524.096
2024-04-01 00:00:00
3150403-B1#&Printed circuit board MASS/LP140WF5-SPL1-5PJ (6850L-1992B)/MARKING 1 REV B1, (cdsx: hardening paste, hot pressing, seamless welding, drying, air washing, bonded , packaged product#&VN
35616
PCE
3828.72
2024-04-01 00:00:00
3150699A002#&Printed circuit board MASS/LP140WUA-SPB1 (6850L-2511A)/MARKING 1, (cdsx: Circuit design, hot pressing, stamping and cutting products, air washing, bonded, product packaging)#&VN
6300
PCE
708.75
2024-04-01 00:00:00
3150463-B0#&Printed circuit board MASS/LA123WF5-SL01-E21(6850L-1702D)/MARKING 1 REV B0 (cdsx: gluing hardening material, hot pressing, circuit sealing, drying, air washing, foreign sealing) packaging, product packaging)#&VN
18000
PCE
2979
2024-04-01 00:00:00
J180011-C1#&Printed circuit board MASS/JFPCX061 (JDI W6J-CS HINGE)/MARKING 1 REV C1, (cdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, sealing) package sp)#&VN
77850
PCE
15056.19
2024-04-01 00:00:00
3150547-B1#&Printed circuit board MASS/LA149QH1-FPC(6850L-2272A)/MARKING 1 REV B1, (cdsx: hardening paste, hot pressing, seamless welding, drying, air washing, bonded, sealing) package sp)#&VN
30656
PCE
12663.9936
2024-04-01 00:00:00
3150528-B7#&Printed circuit board LA103WF5-SL02 (6850L-2237A), (cdsx: hardening paste, hot pressing, seamless welding, drying, air washing, bonded, packaging)#&VN
5400
PCE
7212.78
2024-04-01 00:00:00
3150559-B1#&Printed circuit board MASS/LA123WF7-SL02 (6850L-2277A)/MARKING 1 REV B1, (hardening material paste, hot pressing, seamless sealing, drying, air washing, bonded, packaging sp)#&VN
6390
PCE
10465.542
2024-04-01 00:00:00
3150545-B4#&Printed circuit board LA080WH1-SL01 (6850L-2273A), (cdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, packaging)#&VN
4248
PCE
7346.0664
2024-04-01 00:00:00
3150554-B2#&Printed circuit board LA080WH1-SL02 (6850L-2289A), (stiffening paste, hot pressing, seamless sealing, drying, air washing, bonded, packaging)#&VN
3240
PCE
5954.148
