Live import data of Vietnam import from korea republic under the HS code 85340030 via port Cchq bac ninh, our Vietnam customs import data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-01 00:00:00 |
85340030
|
WTJPEDP0105#&Multi-layer flexible printed circuit without components, model: (R0.3)SM-A556B FRC+SUB PBA(S/K) | Korea (Republic) | CCHQ Bac Ninh | 639776 | PCE | 86337.7712 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB629FF01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 100x268mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 10 | PCE | 2100 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
Multi-layer electrostatic printed circuit board A233 R-> T PJT R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Size: 300x110mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 20 | PCE | 4520 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
Multi-layer electrostatic printed circuit board AMB627EF01 R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Dimensions: 305x110mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 20 | PCE | 4520 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB632FG01 R_OCA multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 72x277mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 3 | PCE | 810 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB675FH01 R_PANEL multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 79x290mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 7 | PCE | 1890 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB629FF01 R_PANEL multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 76x285mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 7 | PCE | 1890 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB625GR01 R_OCA multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 67x277mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 7 | PCE | 1890 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
AMB625GR01 R_PANEL multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 110x280mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 7 | PCE | 1890 | Importer Name |
| 2024-04-02 00:00:00 |
85340030
|
A252 DOE N_D MAIN LOWER Ver.Si Coating multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 290x78mm. New 100% | Korea (Republic) | CCHQ Bac Ninh | 2 | PCE | 632 | Importer Name |
2024-04-01 00:00:00
WTJPEDP0105#&Multi-layer flexible printed circuit without components, model: (R0.3)SM-A556B FRC+SUB PBA(S/K)
639776
PCE
86337.7712
2024-04-02 00:00:00
AMB629FF01 R_WINDOW multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 100x268mm. New 100%
10
PCE
2100
2024-04-02 00:00:00
Multi-layer electrostatic printed circuit board A233 R-> T PJT R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Size: 300x110mm. New 100%
20
PCE
4520
2024-04-02 00:00:00
Multi-layer electrostatic printed circuit board AMB627EF01 R_D MAIN WINDOW Ver.Si Coating without components used to produce mobile phones. Dimensions: 305x110mm. New 100%
20
PCE
4520
2024-04-02 00:00:00
AMB632FG01 R_OCA multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 72x277mm. New 100%
3
PCE
810
2024-04-02 00:00:00
AMB675FH01 R_PANEL multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 79x290mm. New 100%
7
PCE
1890
2024-04-02 00:00:00
AMB629FF01 R_PANEL multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 76x285mm. New 100%
7
PCE
1890
2024-04-02 00:00:00
AMB625GR01 R_OCA multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 67x277mm. New 100%
7
PCE
1890
2024-04-02 00:00:00
AMB625GR01 R_PANEL multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 110x280mm. New 100%
7
PCE
1890
2024-04-02 00:00:00
A252 DOE N_D MAIN LOWER Ver.Si Coating multi-layer electrostatic printed circuit board without components used to produce mobile phones. Dimensions: 290x78mm. New 100%
2
PCE
632
