Vietnam Customs export data under HS code 848640 to korea (republic) via Port Cchq management of bac giang industrial parks

Live export data of Vietnam export to korea (republic) under the HS code 848640 via port Cchq management of bac giang industrial parks, our Vietnam customs export data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam exporters data

Date

HS Code

Product Description

Destination Country

Custom Name

QTY.

Unit

Value($)

Exporter Name

April 12, 2024

84864030

BTM Cavity 0.265B/0.46T RG 28CH bottom face forming mold of compression molding machine used in semiconductor wafer production, model YPM1180. Partial edit of section 01 of account:105239693160/E13#&KR

Korea (Republic) CCHQ Management of Bac Giang Industrial Parks

3

PCE

4295.7

Exporter Name

April 12, 2024

84864030

TOP Cavity 0.18B/0.39T CP 23CH DDR5 bottom face mold of molding machine using compression mold used in semiconductor wafer production, model YPM1180.Partial edit of section 01 of account:105239693160/E13#&KR

Korea (Republic) CCHQ Management of Bac Giang Industrial Parks

2

PCE

2863.8

Exporter Name

April 12, 2024

84864030

Top Cavity 0.265B/0.46T RG 28CH DDR4 bottom surface molding machine of compression molding machine used in semiconductor wafer production, model YPM1180.Partial edit of section 01 of account:105239693160/E13#&KR

Korea (Republic) CCHQ Management of Bac Giang Industrial Parks

1

PCE

1431.9

Exporter Name

Shipment No. 1

Date

2024-04-12 00:00:00

HS CODE

Product Description

BTM Cavity 0.265B/0.46T RG 28CH bottom face forming mold of compression molding machine used in semiconductor wafer production, model YPM1180. Partial edit of section 01 of account:105239693160/E13#&KR

Destination Country

Unloading Port

QTY

3

Unit

PCE

Value($)

4295.7

Exporter Name

Shipment No. 2

Date

2024-04-12 00:00:00

HS CODE

Product Description

TOP Cavity 0.18B/0.39T CP 23CH DDR5 bottom face mold of molding machine using compression mold used in semiconductor wafer production, model YPM1180.Partial edit of section 01 of account:105239693160/E13#&KR

Destination Country

Unloading Port

QTY

2

Unit

PCE

Value($)

2863.8

Exporter Name

Shipment No. 3

Date

2024-04-12 00:00:00

HS CODE

Product Description

Top Cavity 0.265B/0.46T RG 28CH DDR4 bottom surface molding machine of compression molding machine used in semiconductor wafer production, model YPM1180.Partial edit of section 01 of account:105239693160/E13#&KR

Destination Country

Unloading Port

QTY

1

Unit

PCE

Value($)

1431.9

Exporter Name

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