Live export data of Vietnam export to korea (republic) under the HS code 84209110 via port Cchq management of yen phong industrial parks, our Vietnam customs export data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam exporters data
Date |
HS Code |
Product Description |
Destination Country |
Custom Name |
QTY. |
Unit |
Value($) |
Exporter Name |
|---|---|---|---|---|---|---|---|---|
|
April 8, 2024 |
84209110 |
The steel hot roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 80 (770 mm)#&KR |
Korea (Republic) | CCHQ Management of Yen Phong Industrial Parks |
4 |
PCE |
2845.84 |
Exporter Name |
|
April 8, 2024 |
84209110 |
The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (LAMI #1 - #2): Size: phi 80 (740 mm )#&KR |
Korea (Republic) | CCHQ Management of Yen Phong Industrial Parks |
4 |
PCE |
2845.84 |
Exporter Name |
|
April 8, 2024 |
84209110 |
The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 100 (770 mm)#&KR |
Korea (Republic) | CCHQ Management of Yen Phong Industrial Parks |
2 |
PCE |
1778.64 |
Exporter Name |
|
April 8, 2024 |
84209110 |
The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Laminating #3,4,): Size: phi 100 (745 mm )#&KR |
Korea (Republic) | CCHQ Management of Yen Phong Industrial Parks |
2 |
PCE |
1778.64 |
Exporter Name |
2024-04-08 00:00:00
The steel hot roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 80 (770 mm)#&KR
4
PCE
2845.84
2024-04-08 00:00:00
The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (LAMI #1 - #2): Size: phi 80 (740 mm )#&KR
4
PCE
2845.84
2024-04-08 00:00:00
The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 100 (770 mm)#&KR
2
PCE
1778.64
2024-04-08 00:00:00
The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Laminating #3,4,): Size: phi 100 (745 mm )#&KR
2
PCE
1778.64
