Vietnam Customs import data under HS code 392099 from korea (republic) via Port Cchq kcep and ip

Live import data of Vietnam import from korea (republic) under the HS code 392099 via port Cchq kcep and ip, our Vietnam customs import data reports include the date, value, quantity, product description, HS code, port, country, and Vietnam importers data

Date

HS Code

Product Description

Origin Country

Custom Name

QTY.

Unit

Value($)

Importer Name

2024-04-09 00:00:00
39209990
Epoxy resin, polyimide Film, rolls used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200K N 2530 S 500, 56um thick, 0.5m wide, manufactured by DOOSAN, new 100% Korea (Republic) CCHQ KCEP and IP 4000 MTR 24200 Importer Name
2024-04-19 00:00:00
39209990
Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new Korea (Republic) CCHQ KCEP and IP 6800 MTR 41004 Importer Name
2024-04-22 00:00:00
39209990
ST-CP4055P(0.07T) film made of Polyolefin plastic, non-porous and unreinforced, not bonded with other materials, dimension: 930mm*200m, thickness: 0.07mm, used in electronic components production. New 100% Korea (Republic) CCHQ KCEP and IP 3720 MTK 14991.6 Importer Name
2024-04-05 00:00:00
39209990
Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new Korea (Republic) CCHQ KCEP and IP 3168 MTR 19103.04 Importer Name
2024-04-01 00:00:00
39209990
Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new Korea (Republic) CCHQ KCEP and IP 6800 MTR 41004 Importer Name
2024-04-09 00:00:00
39209990
PFDS005CF01#&Film, size: 1080mm*1000M*0.05T, 100% new Korea (Republic) CCHQ KCEP and IP 3240 MTK 3985.2 Importer Name
2024-04-11 00:00:00
39209990
Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new Korea (Republic) CCHQ KCEP and IP 6800 MTR 41004 Importer Name
2024-04-15 00:00:00
39209990
ST-CP4055P(0.07T) film made of Polyolefin plastic, non-porous and unreinforced, not bonded with other materials, dimension: 350mm*200m, thickness: 0.07mm, used in electronic components production. New 100% Korea (Republic) CCHQ KCEP and IP 420 MTK 1692.6 Importer Name
2024-04-22 00:00:00
39209990
Epoxy resin, polyimide Film, rolls used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 500, 56um thick, 0.5m wide, manufactured by DOOSAN, new 100% Korea (Republic) CCHQ KCEP and IP 257 MTR 1359.53 Importer Name
2024-04-01 00:00:00
39209921
PUSK020BD01#&PolyUrethane plastic pad used to produce plastic stickers, all sizes, 100% new Korea (Republic) CCHQ KCEP and IP 49 MTK 916.3 Importer Name

Shipment No. 1

Date

2024-04-09 00:00:00

HS CODE

Product Description

Epoxy resin, polyimide Film, rolls used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200K N 2530 S 500, 56um thick, 0.5m wide, manufactured by DOOSAN, new 100%

Origin Country

Unloading Port

QTY

4000

Unit

MTR

Value($)

24200

Importer Name

Shipment No. 2

Date

2024-04-19 00:00:00

HS CODE

Product Description

Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new

Origin Country

Unloading Port

QTY

6800

Unit

MTR

Value($)

41004

Importer Name

Shipment No. 3

Date

2024-04-22 00:00:00

HS CODE

Product Description

ST-CP4055P(0.07T) film made of Polyolefin plastic, non-porous and unreinforced, not bonded with other materials, dimension: 930mm*200m, thickness: 0.07mm, used in electronic components production. New 100%

Origin Country

Unloading Port

QTY

3720

Unit

MTK

Value($)

14991.6

Importer Name

Shipment No. 4

Date

2024-04-05 00:00:00

HS CODE

Product Description

Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new

Origin Country

Unloading Port

QTY

3168

Unit

MTR

Value($)

19103.04

Importer Name

Shipment No. 5

Date

2024-04-01 00:00:00

HS CODE

Product Description

Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new

Origin Country

Unloading Port

QTY

6800

Unit

MTR

Value($)

41004

Importer Name

Shipment No. 6

Date

2024-04-09 00:00:00

HS CODE

Product Description

PFDS005CF01#&Film, size: 1080mm*1000M*0.05T, 100% new

Origin Country

Unloading Port

QTY

3240

Unit

MTK

Value($)

3985.2

Importer Name

Shipment No. 7

Date

2024-04-11 00:00:00

HS CODE

Product Description

Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new

Origin Country

Unloading Port

QTY

6800

Unit

MTR

Value($)

41004

Importer Name

Shipment No. 8

Date

2024-04-15 00:00:00

HS CODE

Product Description

ST-CP4055P(0.07T) film made of Polyolefin plastic, non-porous and unreinforced, not bonded with other materials, dimension: 350mm*200m, thickness: 0.07mm, used in electronic components production. New 100%

Origin Country

Unloading Port

QTY

420

Unit

MTK

Value($)

1692.6

Importer Name

Shipment No. 9

Date

2024-04-22 00:00:00

HS CODE

Product Description

Epoxy resin, polyimide Film, rolls used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 500, 56um thick, 0.5m wide, manufactured by DOOSAN, new 100%

Origin Country

Unloading Port

QTY

257

Unit

MTR

Value($)

1359.53

Importer Name

Shipment No. 10

Date

2024-04-01 00:00:00

HS CODE

Product Description

PUSK020BD01#&PolyUrethane plastic pad used to produce plastic stickers, all sizes, 100% new

Origin Country

Unloading Port

QTY

49

Unit

MTK

Value($)

916.3

Importer Name

FAQs With Answers

Vietnam HS Code 392099 import data from korea-(republic) via Port Cchq-kcep-and-ip processing includes shipment-level details such as shipment date, product description, HS codes, quantity, value, country of origin & destination, port details, and importer-exporter information.

Vietnam import data from korea-(republic) under HS Code 392099 through this port is highly valuable for market research and business strategy. It enables companies to track demand trends for products under HS code 392099, identify key importers & competitors, analyze pricing patterns, and understand sourcing behavior. Businesses can use these insights to find new buyers, optimize supply chains, evaluate market entry opportunities, and make data-driven decisions to stay competitive in Vietnam’s import industry.

This data helps companies track Vietnam-korea-(republic) trade flows for products under HS code 392099, identify active importers, access port activities, analyze pricing trends, and discover sourcing or partnership opportunities in Vietnam’s market.

korea-(republic) is a key supplier due to its large-scale production capacity, competitive pricing, and strong integration with Vietnam’s manufacturing supply chains.

The database is regularly updated with recent shipment records, allowing businesses to access timely insights and monitor real-time trade activity.

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