Live Plastic Import data of Vietnam imports from korea-republic under HS Code 390490 via Port Hoa-binh-provincial-headquarters , our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam plastic importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-11 00:00:00 |
39049090
|
PBT#&PBT-B4300-G6-BLK plastic granule code R-G102 | Korea (Republic) | Hoa Binh Provincial Headquarters | 500000 | GRM | 2341 | Importer Name |
| 2024-04-11 00:00:00 |
39049090
|
CNP04#&PA plastic granules (Polyamide) used for molding and shaping semiconductor connector components PA66-KN332G30V0-NAT code R-B111 | Korea (Republic) | Hoa Binh Provincial Headquarters | 1000000 | GRM | 7091 | Importer Name |
| 2024-04-04 00:00:00 |
39049090
|
PBT#&PBT-B4300-G6-BLK plastic masterbatch RESSIN code R-G102 | Korea (Republic) | Hoa Binh Provincial Headquarters | 20000 | GRM | 93.64 | Importer Name |
| 2024-04-04 00:00:00 |
39049090
|
CNP04#&PA (Polyamide) plastic granules used for molding and shaping semiconductor connector components PA9T-TA115-WHT RESSIN code R-D106 | Korea (Republic) | Hoa Binh Provincial Headquarters | 200000 | GRM | 3127.2 | Importer Name |
| 2024-04-25 00:00:00 |
39049090
|
CNP04#&PA plastic granules (Polyamide) used for molding and shaping semiconductor connector components PA66-A50H1-BLK code R-B119 | Korea (Republic) | Hoa Binh Provincial Headquarters | 200000 | GRM | 1037.8 | Importer Name |
| 2024-04-11 00:00:00 |
39049090
|
CNP04#&PA (Polyamide) plastic granules used for molding and shaping semiconductor connector components PA9T-TA115-WHT code R-D106 | Korea (Republic) | Hoa Binh Provincial Headquarters | 500000 | GRM | 7818 | Importer Name |
| 2024-04-19 00:00:00 |
39049090
|
CNP04#&PA plastic granules (Polyamide) used for molding and shaping semiconductor connector components PA66-KN3322V0HF-NAT code R-B118 | Korea (Republic) | Hoa Binh Provincial Headquarters | 200000 | GRM | 1236.4 | Importer Name |
| 2024-04-19 00:00:00 |
39049090
|
CNP04#&PA (Polyamide) plastic granules used for molding and shaping semiconductor connector components PA9T-TA115-WHT code R-D106 | Korea (Republic) | Hoa Binh Provincial Headquarters | 300000 | GRM | 4690.8 | Importer Name |
| 2024-04-25 00:00:00 |
39049090
|
CNP04#&PA (Polyamide) plastic granules used for molding and shaping semiconductor connector components PA9T-TA115-WHT code R-D106 | Korea (Republic) | Hoa Binh Provincial Headquarters | 700000 | GRM | 10945.2 | Importer Name |
| 2024-04-11 00:00:00 |
39049090
|
CNP04#&PA plastic granules (Polyamide) used to mold and shape semiconductor connector components PA4T F12(GF40%)-BLK code R-H102 | Korea (Republic) | Hoa Binh Provincial Headquarters | 300000 | GRM | 5045.4 | Importer Name |
2024-04-11 00:00:00
PBT#&PBT-B4300-G6-BLK plastic granule code R-G102
500000
GRM
2341
2024-04-11 00:00:00
CNP04#&PA plastic granules (Polyamide) used for molding and shaping semiconductor connector components PA66-KN332G30V0-NAT code R-B111
1000000
GRM
7091
2024-04-04 00:00:00
PBT#&PBT-B4300-G6-BLK plastic masterbatch RESSIN code R-G102
20000
GRM
93.64
2024-04-04 00:00:00
CNP04#&PA (Polyamide) plastic granules used for molding and shaping semiconductor connector components PA9T-TA115-WHT RESSIN code R-D106
200000
GRM
3127.2
2024-04-25 00:00:00
CNP04#&PA plastic granules (Polyamide) used for molding and shaping semiconductor connector components PA66-A50H1-BLK code R-B119
200000
GRM
1037.8
2024-04-11 00:00:00
CNP04#&PA (Polyamide) plastic granules used for molding and shaping semiconductor connector components PA9T-TA115-WHT code R-D106
500000
GRM
7818
2024-04-19 00:00:00
CNP04#&PA plastic granules (Polyamide) used for molding and shaping semiconductor connector components PA66-KN3322V0HF-NAT code R-B118
200000
GRM
1236.4
2024-04-19 00:00:00
CNP04#&PA (Polyamide) plastic granules used for molding and shaping semiconductor connector components PA9T-TA115-WHT code R-D106
300000
GRM
4690.8
2024-04-25 00:00:00
CNP04#&PA (Polyamide) plastic granules used for molding and shaping semiconductor connector components PA9T-TA115-WHT code R-D106
700000
GRM
10945.2
2024-04-11 00:00:00
CNP04#&PA plastic granules (Polyamide) used to mold and shape semiconductor connector components PA4T F12(GF40%)-BLK code R-H102
300000
GRM
5045.4
