Live Copper Import data of Vietnam imports from korea-(republic) under HS Code 382499 via Port Cchq-bac-ninh , our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam copper importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-11 00:00:00 |
38249999
|
.#&Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-430PK (Sodium chloride 18-23%, Hydrogen chloride 1-4%, Additive <1%, water 72-81%). New 100% | Korea (Republic) | CCHQ Bac Ninh | 8000 | KGM | 11695.52 | Importer Name |
| 2024-04-03 00:00:00 |
38249999
|
NL128#&Cu AD-1000 copper plating solution supplement (1KG/CAN) (Content: thiourea 0.5%, SODIUM SACCHARIN 0.5%, Water 99%). 100% new product #&KR | Korea (Republic) | CCHQ Bac Ninh | 10 | KGM | 399.2 | Importer Name |
| 2024-04-05 00:00:00 |
38249999
|
Copperzinc, Sodium cyanide SODIUM COPPER-ZINC CYANIDE SALT (BRASS SALT) (COPPER CYANIDE 38%, ZINC CYANIDE 10%, SODIUM CYANIDE 52%) (15KG/CAN). 100% new product | Korea (Republic) | CCHQ Bac Ninh | 90 | KGM | 630 | Importer Name |
| 2024-04-03 00:00:00 |
38249999
|
NL22#&Imitation gold powder form IMITATION GOLD(Copper cyanide,Zinc cyanide,Sodium cyanide,sodium statanate)(15kg/can).100% brand new#&KR | Korea (Republic) | CCHQ Bac Ninh | 15 | KGM | 173.25 | Importer Name |
| 2024-04-03 00:00:00 |
38249999
|
NL19#&Imitation GOLD powdered imitation gold (Copper cyanide,Zinc cyanide,Sodium cyanide,sodium statanate)(15kg/can).100% new product#&KR | Korea (Republic) | CCHQ Bac Ninh | 30 | KGM | 346.5 | Importer Name |
| 2024-04-11 00:00:00 |
38249999
|
CYCO #35 solution, an additive used in copper plating technology, includes: SODIUM CARBONATE: 9%, Ammonium hydrogendifluoride: 0.5%, 20kg/can, 100% new.KQPTPL:454/TB-KD6 (November 18, 2021). ) | Korea (Republic) | CCHQ Bac Ninh | 5 | UNL | 636.2271 | Importer Name |
| 2024-04-11 00:00:00 |
38249999
|
.#&Additives in the PCB circuit board plating process: ORC-465M(I) (Copper(II) sulfate, pentahydrate 8-14%, Additive 27-33%, water 54-63% ). New 100% | Korea (Republic) | CCHQ Bac Ninh | 2440 | KGM | 12499.7052 | Importer Name |
| 2024-04-11 00:00:00 |
38249999
|
.#&Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-465A (Copper(II) sulfate, pentahydrate 12-20%, Formaldehyde 3-9%, Additive 4-8%, water 68-77% ) . New 100% | Korea (Republic) | CCHQ Bac Ninh | 15600 | KGM | 34240.752 | Importer Name |
| 2024-04-11 00:00:00 |
38249999
|
.#&Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-448 (Tin chloride dihydrate 10-18%,Palladium dichloride <1%,Hydrogen chloride 1-5%,Additive 15-22%,water 60 -68%).100% new product | Korea (Republic) | CCHQ Bac Ninh | 220 | KGM | 26668.4638 | Importer Name |
| 2024-04-17 00:00:00 |
38249999
|
Imitation gold powder form IMITATION GOLD (Copper cyanide 30%, Zinc cyanide 10%, Sodium cyanide 50%, sodium statanate 10%) (15kg/can). New 100% | Korea (Republic) | CCHQ Bac Ninh | 480 | KGM | 4622.4 | Importer Name |
2024-04-11 00:00:00
.#&Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-430PK (Sodium chloride 18-23%, Hydrogen chloride 1-4%, Additive <1%, water 72-81%). New 100%
8000
KGM
11695.52
2024-04-03 00:00:00
NL128#&Cu AD-1000 copper plating solution supplement (1KG/CAN) (Content: thiourea 0.5%, SODIUM SACCHARIN 0.5%, Water 99%). 100% new product #&KR
10
KGM
399.2
2024-04-05 00:00:00
Copperzinc, Sodium cyanide SODIUM COPPER-ZINC CYANIDE SALT (BRASS SALT) (COPPER CYANIDE 38%, ZINC CYANIDE 10%, SODIUM CYANIDE 52%) (15KG/CAN). 100% new product
90
KGM
630
2024-04-03 00:00:00
NL22#&Imitation gold powder form IMITATION GOLD(Copper cyanide,Zinc cyanide,Sodium cyanide,sodium statanate)(15kg/can).100% brand new#&KR
15
KGM
173.25
2024-04-03 00:00:00
NL19#&Imitation GOLD powdered imitation gold (Copper cyanide,Zinc cyanide,Sodium cyanide,sodium statanate)(15kg/can).100% new product#&KR
30
KGM
346.5
2024-04-11 00:00:00
CYCO #35 solution, an additive used in copper plating technology, includes: SODIUM CARBONATE: 9%, Ammonium hydrogendifluoride: 0.5%, 20kg/can, 100% new.KQPTPL:454/TB-KD6 (November 18, 2021). )
5
UNL
636.2271
2024-04-11 00:00:00
.#&Additives in the PCB circuit board plating process: ORC-465M(I) (Copper(II) sulfate, pentahydrate 8-14%, Additive 27-33%, water 54-63% ). New 100%
2440
KGM
12499.7052
2024-04-11 00:00:00
.#&Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-465A (Copper(II) sulfate, pentahydrate 12-20%, Formaldehyde 3-9%, Additive 4-8%, water 68-77% ) . New 100%
15600
KGM
34240.752
2024-04-11 00:00:00
.#&Non-electrolytic copper plating additive in the PCB circuit board plating process: ORC-448 (Tin chloride dihydrate 10-18%,Palladium dichloride <1%,Hydrogen chloride 1-5%,Additive 15-22%,water 60 -68%).100% new product
220
KGM
26668.4638
2024-04-17 00:00:00
Imitation gold powder form IMITATION GOLD (Copper cyanide 30%, Zinc cyanide 10%, Sodium cyanide 50%, sodium statanate 10%) (15kg/can). New 100%
480
KGM
4622.4
