Live Copper Import data of Vietnam imports from korea-(republic) under HS Code 38 via Port Vinh-phuc-headquarters , our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam copper importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-17 00:00:00 |
38249999
|
Chemical ORC-372, chemical preparation used in plating industry whose main ingredients are sulfate salt of copper, sodium and additives, in acidic environment, liquid form. 100% new (PTPL 1120/TB-KD2)( September 30, 2021) | Korea (Republic) | Vinh Phuc Headquarters | 2400 | KGM | 2328 | Importer Name |
| 2024-04-17 00:00:00 |
38249999
|
Copper plating additive HVF EL-CU M H1 contains Sodium hydroxide 12 +/- 3%, nickel sulfate, hexahydrate <1%, the remainder is water, 20L /can. New 100% | Korea (Republic) | Vinh Phuc Headquarters | 4800 | LTR | 14640 | Importer Name |
| 2024-04-22 00:00:00 |
38249999
|
MJH H-CUPRUM M2 chemical contains NaOH 10+/-2%,KNaC4H4O6.2H2O 30+/-5,NiCl2.6H20 0.5+/-0.4%,CoSO4.5H2O 0.2+/-0.1% used in copper plating.20l /can. 100% New | Korea (Republic) | Vinh Phuc Headquarters | 4000 | LTR | 14080 | Importer Name |
| 2024-04-22 00:00:00 |
38249999
|
Copper plating additive HVF EL-CU M H1 contains Sodium hydroxide 12 +/- 3%, nickel sulfate, hexahydrate <1%, the remainder is water, 20l /can. New 100% | Korea (Republic) | Vinh Phuc Headquarters | 1280 | LTR | 3904 | Importer Name |
| 2024-04-22 00:00:00 |
38249999
|
HVF EL-CU S H1: Preparation used in copper plating, containing 2,2'-Bipyridyl < 1%, the rest is water. 20l/can. New 100% | Korea (Republic) | Vinh Phuc Headquarters | 500 | LTR | 1290 | Importer Name |
| 2024-04-22 00:00:00 |
38249999
|
Chemical MJH H-CUPRUM A1(CuSO4.5H2O 17+/-5%;H2SO4 3+/-2%,NiSO4.6H2O 0.5+/-0.4%;CoSO4.5H2O 0.09+/-0.07%) used in copper plating . 20l/can, 100% New | Korea (Republic) | Vinh Phuc Headquarters | 4000 | LTR | 11520 | Importer Name |
| 2024-04-24 00:00:00 |
38140000
|
CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating | Korea (Republic) | Vinh Phuc Headquarters | 1.5 | KGM | 101.4 | Importer Name |
| 2024-04-24 00:00:00 |
38140000
|
SOLVENT_PSR-9000-KD#&Solvent(CA-90 FLX29EML), 1 bottle=0.15kg, TP: Dipropylene glycol monomethyl ether,Diethylene glycol monoethyl ether acetate...used to mix with PSR-9000 FLX29EML Copper Board Coating | Korea (Republic) | Vinh Phuc Headquarters | 15 | KGM | 1242.15 | Importer Name |
| 2024-04-25 00:00:00 |
38249999
|
ORC-465A product used in plating industry has main ingredients including copper sulfate salt and additives, in liquid form. 100% new goods (PTPL conclusion No. 62/TB-KD2 dated January 15, 2024) | Korea (Republic) | Vinh Phuc Headquarters | 8000 | KGM | 11600 | Importer Name |
| 2024-04-27 00:00:00 |
38140000
|
SOLVENT_FLX505EM-KD#&Solvent (CA-90 FLX505EM), 1 bottle=0.25kg, Main ingredients are Epoxy Resin (25-35%), Acrylic ester resin (25-35%) used to mix with PSR Copper Board Coating -9000 FLX505EM, 100% new | Korea (Republic) | Vinh Phuc Headquarters | 2.5 | KGM | 136.575 | Importer Name |
2024-04-17 00:00:00
Chemical ORC-372, chemical preparation used in plating industry whose main ingredients are sulfate salt of copper, sodium and additives, in acidic environment, liquid form. 100% new (PTPL 1120/TB-KD2)( September 30, 2021)
2400
KGM
2328
2024-04-17 00:00:00
Copper plating additive HVF EL-CU M H1 contains Sodium hydroxide 12 +/- 3%, nickel sulfate, hexahydrate <1%, the remainder is water, 20L /can. New 100%
4800
LTR
14640
2024-04-22 00:00:00
MJH H-CUPRUM M2 chemical contains NaOH 10+/-2%,KNaC4H4O6.2H2O 30+/-5,NiCl2.6H20 0.5+/-0.4%,CoSO4.5H2O 0.2+/-0.1% used in copper plating.20l /can. 100% New
4000
LTR
14080
2024-04-22 00:00:00
Copper plating additive HVF EL-CU M H1 contains Sodium hydroxide 12 +/- 3%, nickel sulfate, hexahydrate <1%, the remainder is water, 20l /can. New 100%
1280
LTR
3904
2024-04-22 00:00:00
HVF EL-CU S H1: Preparation used in copper plating, containing 2,2'-Bipyridyl < 1%, the rest is water. 20l/can. New 100%
500
LTR
1290
2024-04-22 00:00:00
Chemical MJH H-CUPRUM A1(CuSO4.5H2O 17+/-5%;H2SO4 3+/-2%,NiSO4.6H2O 0.5+/-0.4%;CoSO4.5H2O 0.09+/-0.07%) used in copper plating . 20l/can, 100% New
4000
LTR
11520
2024-04-24 00:00:00
CA-90 V10-KD#&Solvent (CA-90 FLX29EML), 1 bottle=0.15kg, TP is 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl( 1,1'-biphenyl), Epoxy Resin &., for mixing with PSR-9000 FLX29EML Copper Board Coating
1.5
KGM
101.4
2024-04-24 00:00:00
SOLVENT_PSR-9000-KD#&Solvent(CA-90 FLX29EML), 1 bottle=0.15kg, TP: Dipropylene glycol monomethyl ether,Diethylene glycol monoethyl ether acetate...used to mix with PSR-9000 FLX29EML Copper Board Coating
15
KGM
1242.15
2024-04-25 00:00:00
ORC-465A product used in plating industry has main ingredients including copper sulfate salt and additives, in liquid form. 100% new goods (PTPL conclusion No. 62/TB-KD2 dated January 15, 2024)
8000
KGM
11600
2024-04-27 00:00:00
SOLVENT_FLX505EM-KD#&Solvent (CA-90 FLX505EM), 1 bottle=0.25kg, Main ingredients are Epoxy Resin (25-35%), Acrylic ester resin (25-35%) used to mix with PSR Copper Board Coating -9000 FLX505EM, 100% new
2.5
KGM
136.575
