Live Copper Import data of Vietnam imports from korea-(republic) under HS Code 38 via Port Tien-s-inland-port-authorityheyn , our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam copper importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-17 00:00:00 |
38249999
|
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 200 | LTR | 3172 | Importer Name |
| 2024-04-26 00:00:00 |
38101000
|
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 80000 | GRM | 6312 | Importer Name |
| 2024-04-02 00:00:00 |
38101000
|
NL97#&Solder tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, ..), 100% new, code 0701-000001B | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 60000 | GRM | 4734 | Importer Name |
| 2024-04-17 00:00:00 |
38249999
|
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 200 | LTR | 3172 | Importer Name |
| 2024-04-26 00:00:00 |
38101000
|
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 20000 | GRM | 1578 | Importer Name |
| 2024-04-26 00:00:00 |
38101000
|
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 20000 | GRM | 1578 | Importer Name |
| 2024-04-08 00:00:00 |
38249999
|
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 200 | LTR | 3154 | Importer Name |
| 2024-04-17 00:00:00 |
38249999
|
OCHW00012#&BMS-903A solution is used to remove the copper layer on the wafer surface after UV irradiation. TP:Sulfinylbismethane 85~90%,1,2-Ethanediol 5~10%,Water 1~5%,Tetramethylammonium hydroxide 0.6 ~1%, 100% new | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 480 | LTR | 7358.4 | Importer Name |
| 2024-04-26 00:00:00 |
38101000
|
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 60000 | GRM | 4734 | Importer Name |
| 2024-04-26 00:00:00 |
38101000
|
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 60000 | GRM | 4734 | Importer Name |
2024-04-17 00:00:00
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new
200
LTR
3172
2024-04-26 00:00:00
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B
80000
GRM
6312
2024-04-02 00:00:00
NL97#&Solder tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, ..), 100% new, code 0701-000001B
60000
GRM
4734
2024-04-17 00:00:00
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new
200
LTR
3172
2024-04-26 00:00:00
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B
20000
GRM
1578
2024-04-26 00:00:00
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B
20000
GRM
1578
2024-04-08 00:00:00
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new
200
LTR
3154
2024-04-17 00:00:00
OCHW00012#&BMS-903A solution is used to remove the copper layer on the wafer surface after UV irradiation. TP:Sulfinylbismethane 85~90%,1,2-Ethanediol 5~10%,Water 1~5%,Tetramethylammonium hydroxide 0.6 ~1%, 100% new
480
LTR
7358.4
2024-04-26 00:00:00
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B
60000
GRM
4734
2024-04-26 00:00:00
NL97#&Soldering tin for circuit boards, cream, 500g/box (ingredients: tin 83.8-91.7%, silver 2-3%, copper 0.2-0.7%, .., 100% new, code 0701-000001B
60000
GRM
4734
