Live Copper Import data of Vietnam imports from korea-republic under HS Code 382499 via Port Tien-s-inland-port-authorityheyn , our Vietnam customs import data reports include date, value, quantity, product description, HS code, port, country, and Vietnam copper importers data
| Date |
HS Code |
Product Description |
Origin Country |
Custom Name |
QTY. |
Unit |
Value($) |
Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-17 00:00:00 |
38249999
|
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 200 | LTR | 3172 | Importer Name |
| 2024-04-17 00:00:00 |
38249999
|
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 200 | LTR | 3172 | Importer Name |
| 2024-04-08 00:00:00 |
38249999
|
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 200 | LTR | 3154 | Importer Name |
| 2024-04-17 00:00:00 |
38249999
|
OCHW00012#&BMS-903A solution is used to remove the copper layer on the wafer surface after UV irradiation. TP:Sulfinylbismethane 85~90%,1,2-Ethanediol 5~10%,Water 1~5%,Tetramethylammonium hydroxide 0.6 ~1%, 100% new | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 480 | LTR | 7358.4 | Importer Name |
2024-04-17 00:00:00
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new
200
LTR
3172
2024-04-17 00:00:00
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new
200
LTR
3172
2024-04-08 00:00:00
OCHW00007#&Solvent used for copper plating (COPPER BASIC SOLUTION). Ingredients: Sulfuric acid 5%, Copper sulfate pentahydrate 20%, DI water 75%, 100% new
200
LTR
3154
2024-04-17 00:00:00
OCHW00012#&BMS-903A solution is used to remove the copper layer on the wafer surface after UV irradiation. TP:Sulfinylbismethane 85~90%,1,2-Ethanediol 5~10%,Water 1~5%,Tetramethylammonium hydroxide 0.6 ~1%, 100% new
480
LTR
7358.4
