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2024-04-09 00:00:00
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39219090
|
Epoxy resin sheet used in electronic circuit board production, non-self-adhesive, non-porous, combined with glass fiber, size: 250x400x0.15mm, (Main material: Glass fiber, Epoxy resin), EPOXY 0.15T. 100% new
|
Korea (Republic)
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CCHQ Management of Bac Giang Industrial Parks
|
2040
|
TAM
|
1741.752
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Importer Name
|
|
2024-04-08 00:00:00
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39219090
|
Epoxy resin used in electronic circuit board production, non-self-adhesive, non-porous, combined with glass fiber, size: 13.2x3.1x0.45mm, (Main material: Glass fiber, Epoxy resin), SM-A307_(EPOXY_0 .45T).100% New
|
Korea (Republic)
|
CCHQ Management of Bac Giang Industrial Parks
|
1200
|
PCE
|
10.92
|
Importer Name
|
|
2024-04-03 00:00:00
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39219090
|
Epoxy resin sheet used in electronic circuit board production, non-self-adhesive, non-porous, combined with glass fiber, size: 250x400x0.35mm, (Main material: Glass fiber, Epoxy resin), VMQ6-0201001_SIM_EPOXY_CS_(DZ-YU140HF 0.35 T)
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Korea (Republic)
|
CCHQ Management of Bac Giang Industrial Parks
|
10
|
TAM
|
14.639
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Importer Name
|
|
2024-04-09 00:00:00
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39219090
|
Epoxy resin sheet used in electronic circuit board production, non-self-adhesive, non-porous, combined with glass fiber, size: 250x400x0.2mm, (main material: glass fiber, epoxy resin), SM-F956U SUB PBA(VK) _EPOXY_CS_(DZ-YU140HF 0.2T)
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Korea (Republic)
|
CCHQ Management of Bac Giang Industrial Parks
|
13
|
TAM
|
21.7451
|
Importer Name
|
|
2024-04-13 00:00:00
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39219090
|
Epoxy resin sheet used in electronic circuit board production, non-self-adhesive, non-porous, combined with glass fiber, size: 250x400x0.35mm, (Main material: Glass fiber, Epoxy resin), VMQ6-0201001_SIM_EPOXY_CS_(DZ-YU140HF 0.35 T)
|
Korea (Republic)
|
CCHQ Management of Bac Giang Industrial Parks
|
15
|
TAM
|
21.9585
|
Importer Name
|
|
2024-04-05 00:00:00
|
39219090
|
Epoxy resin sheet used in electronic circuit board production, non-self-adhesive, non-porous, combined with glass fiber, size: 250x400x0.2mm, (main material: glass fiber, epoxy resin), SM-F956U SUB PBA(VK) _EPOXY_CS_(DZ-YU140HF 0.2T)
|
Korea (Republic)
|
CCHQ Management of Bac Giang Industrial Parks
|
11
|
TAM
|
18.3997
|
Importer Name
|
|
2024-04-08 00:00:00
|
39219090
|
Epoxy resin used in electronic circuit board production, non-self-adhesive, non-porous, combined with glass fiber, size: 10.1x3.3x0.35mm, (Main material: Glass fiber, Epoxy resin), SM-A307_(EPOXY_0 .35T).100% New
|
Korea (Republic)
|
CCHQ Management of Bac Giang Industrial Parks
|
1200
|
PCE
|
8.76
|
Importer Name
|
|
2024-04-08 00:00:00
|
39219090
|
Epoxy resin used in making electronic circuit boards, non-self-adhesive, non-porous, combined with glass fiber, size: 17.45x3.26x0.6mm, (Main material: Glass fiber, Epoxy resin), SM-A307_(EPOXY_0 .6T).100% New
|
Korea (Republic)
|
CCHQ Management of Bac Giang Industrial Parks
|
1200
|
PCE
|
10.92
|
Importer Name
|
|
2024-04-09 00:00:00
|
39219090
|
Epoxy resin sheet used in electronic circuit board production, non-self-adhesive, non-porous, combined with glass fiber, size: 250x400x0.2mm, (main material: Glass fiber, Epoxy resin), EPOXY 0.2T. 100% new
|
Korea (Republic)
|
CCHQ Management of Bac Giang Industrial Parks
|
3000
|
TAM
|
2566.5
|
Importer Name
|