|
2024-04-22 00:00:00
|
38101000
|
Solder paste LFM-48W NH(IMT) -A 11.5% for soldering electronic circuit boards, TP: Sn CAS 7440-31-5(85.40%), Ag CAS 7440-22-4(2.66%), Cu CAS 7440-50-8 (0.44%), Rosin 8050-09-7(5.75%),...
|
Japan
|
CCHQ Top ManagementUh processing
|
100
|
KGM
|
7977
|
Importer Name
|
|
2024-04-22 00:00:00
|
38101000
|
Soldering paste, brand M705-SHF, city: 7440-31-5, 7440-22-4, 7440-50-8, 144413-22-9, 112-59-4... (0.5 Kg/bottle) , used to connect components to electronic circuit boards (Series 01 tk 106191071600/C11), 100% new
|
Korea (Republic)
|
CCHQ Top ManagementUh processing
|
80
|
KGM
|
6893.6
|
Importer Name
|
|
2024-04-11 00:00:00
|
38101000
|
Soldering paste, brand M705-SHF-T6K, city: 7440-31-5, 7440-22-4, 7440-50-8, 144413-22-9, 112-59-4 (0.5 kg/bottle), Used to connect components to electronic circuit boards (Series 02 tk 106191071600/C11). 100% new
|
Korea (Republic)
|
CCHQ Top ManagementUh processing
|
15
|
KGM
|
1342.5
|
Importer Name
|
|
2024-04-02 00:00:00
|
38101000
|
Soldering paste JP500, city: 7440-31-5, 7440-22-4... (0.1 kg/1 syringe) used to connect components to electronic circuit boards (Series 01 tk106179538950/C11)
|
Singapore
|
CCHQ Top ManagementUh processing
|
3
|
KGM
|
680.61
|
Importer Name
|
|
2024-04-10 00:00:00
|
38101000
|
Solder paste LFM-48W NH(IMT) -A 11.5% for soldering electronic circuit boards, TP: Sn CAS 7440-31-5(85.40%), Ag CAS 7440-22-4(2.66%), Cu CAS 7440-50-8 (0.44%), Rosin 8050-09-7(5.75%),...
|
Japan
|
CCHQ Top ManagementUh processing
|
100
|
KGM
|
7977
|
Importer Name
|
|
2024-04-11 00:00:00
|
38101000
|
Soldering paste, brand M705-GRN360-K2-V, city: 7440-3-5, 7440-22-4, 7440-50-8, 144413-22-2, 112-59-4 (0.5 Kg/bottle ), used to connect components to electronic circuit boards. (Series 04k 106191071600/C11). 100% new
|
Korea (Republic)
|
CCHQ Top ManagementUh processing
|
1
|
KGM
|
86.17
|
Importer Name
|
|
2024-04-11 00:00:00
|
38101000
|
Soldering paste, brand M705-GRN360-K2-V, city: 7440-31-5, 7440-22-4, 7440-50-8, 144413-22-9, 112-59-4 (0.5 Kg/bottle ), used to connect components to electronic circuit boards (Series 04 tk 105937325100/C11). 100% new
|
Korea (Republic)
|
CCHQ Top ManagementUh processing
|
20
|
KGM
|
1700.8
|
Importer Name
|
|
2024-04-25 00:00:00
|
38101000
|
Soldering paste, brand M705-GRN360-K2-V, city: 7440-31-5, 7440-22-4,7440-50-8,144413-22-9,112-59-4 (0.5 Kg/bottle), Used to connect components to electronic circuit boards (Series 04 tk 105937325100/C11). 100% New
|
Korea (Republic)
|
CCHQ Top ManagementUh processing
|
20
|
KGM
|
1700.8
|
Importer Name
|
|
2024-04-10 00:00:00
|
38101000
|
Solder paste LFM-48W MR-NH (500G/PC), main ingredients: Sn 7440-31-5 (85.4%), Ag 7440-22-4 (2.66%), Cu 7440-50-8 (0.44 %), used to solder electronic circuit boards, 100% new.
|
Japan
|
CCHQ Top ManagementUh processing
|
140
|
PCE
|
5787.6
|
Importer Name
|
|
2024-04-10 00:00:00
|
38101000
|
Solder paste LFM-48U TM-HP(ST) 30cc/pc, 40g used to solder electronic circuit boards, main ingredients: Sn CAS 7440-31-5 (82.99%), Ag CAS 7440-22-4 (2.58 %), Cu CAS 7440-50-8 (0.43%), Rosin 7%.... 100% new product.
|
Japan
|
CCHQ Top ManagementUh processing
|
20
|
PCE
|
484.182
|
Importer Name
|