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Date |
HS Code |
Product Description |
Origin Country |
Unloading Port |
QTY. |
Unit |
Value($) |
|---|---|---|---|---|---|---|---|
| Nov, 2024 |
381800010
|
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Silicon doped for use in electronics, in the form of discs, wafers or similar forms | Republic of Korea | Kansai Kokusai Airport | 778 | KG | 482.45 |
| Nov, 2024 |
381800020
|
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Other | Republic of Korea | Kansai Kokusai Airport | 61 | KG | 92.1 |
| Nov, 2024 |
382499999
|
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Other: Other: Other: Other | Republic of Korea | Kansai Kokusai Airport | 730 | KG | 142.69 |
Nov, 2024
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Silicon doped for use in electronics, in the form of discs, wafers or similar forms
778
KG
482.45
Nov, 2024
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.: Other
61
KG
92.1
Nov, 2024
Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included.: Other: Other: Other: Other: Other: Other
730
KG
142.69
